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저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 권용재 | - |
| dc.contributor.author | 석종원 | - |
| dc.contributor.author | Jian-Qiang Lu | - |
| dc.contributor.author | Timothy Cale | - |
| dc.contributor.author | Ronald Gutmann | - |
| dc.date.available | 2019-07-29T02:58:16Z | - |
| dc.date.issued | 2007 | - |
| dc.identifier.issn | 0304-128X | - |
| dc.identifier.issn | 2233-9558 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/30540 | - |
| dc.format.extent | 7 | - |
| dc.publisher | 한국화학공학회 | - |
| dc.title | 저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구 | - |
| dc.title.alternative | A Study on Wafer-Level 3D Integration Including Wafer Bonding using Low-k Polymeric Adhesive | - |
| dc.type | Article | - |
| dc.identifier.bibliographicCitation | Korean Chemical Engineering Research(HWAHAK KONGHAK), v.45, no.5, pp 466 - 472 | - |
| dc.identifier.kciid | ART001087385 | - |
| dc.description.isOpenAccess | N | - |
| dc.citation.endPage | 472 | - |
| dc.citation.number | 5 | - |
| dc.citation.startPage | 466 | - |
| dc.citation.title | Korean Chemical Engineering Research(HWAHAK KONGHAK) | - |
| dc.citation.volume | 45 | - |
| dc.identifier.url | https://www.dbpia.co.kr/Journal/articleDetail?nodeId=NODE10437634 | - |
| dc.publisher.location | 대한민국 | - |
| dc.subject.keywordAuthor | Three-dimensional Integration Circuits | - |
| dc.subject.keywordAuthor | Cu Damascene | - |
| dc.subject.keywordAuthor | Wafer Bonding | - |
| dc.subject.keywordAuthor | Low-k Polymeric Adhesive | - |
| dc.subject.keywordAuthor | Bond Strength | - |
| dc.description.journalRegisteredClass | kci | - |
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