평판디스플레이를 위한 열압착법을 이용한 이방성 도전성 필름 접합

Abstract

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated. It was found that Au bumps on driver IC’s were not bonded to the glass substrate when the bonding temperature was below 140 ℃ so bonds were made at temperatures of 163 ℃, 178 ℃ and 199 ℃ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests (-30 ℃, 1 Hr ↔80 ℃, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF’s with higher conductive particle densities at bonding temperatures above 163 ℃. From the experimental results, when the bonding temperature was increased from 163 ℃ to 199 ℃, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.