신뢰성 평가를 위한 자동차 전장 부품의 기계적 접합강도 특성 및 오차범위에 관한 연구
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 전유재 | - |
dc.contributor.author | 김도석 | - |
dc.contributor.author | 신영의 | - |
dc.date.available | 2019-08-16T04:56:17Z | - |
dc.date.issued | 2011 | - |
dc.identifier.issn | 1226-7945 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/33864 | - |
dc.description.abstract | In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen's bonding area below 35.㎟ , and were from 17 to 21% at specimen's bonding area above 12㎟ . On the other hand, Specimen's mean deviation rates were about 5% at specimen's bonding area more than 12 ㎟ . Inversely, at specimen's bonding area is less then 3.5 ㎟ , mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength. | - |
dc.format.extent | 6 | - |
dc.publisher | 한국전기전자재료학회 | - |
dc.title | 신뢰성 평가를 위한 자동차 전장 부품의 기계적 접합강도 특성 및 오차범위에 관한 연구 | - |
dc.title.alternative | A Study on the Characteristics and Error Ranges of Automotive Application Component's Mechanical Bonding Strength for the Its Reliability Evaluation | - |
dc.type | Article | - |
dc.identifier.bibliographicCitation | 전기전자재료학회논문지, v.24, no.12, pp 949 - 954 | - |
dc.identifier.kciid | ART001607180 | - |
dc.description.isOpenAccess | N | - |
dc.citation.endPage | 954 | - |
dc.citation.number | 12 | - |
dc.citation.startPage | 949 | - |
dc.citation.title | 전기전자재료학회논문지 | - |
dc.citation.volume | 24 | - |
dc.publisher.location | 대한민국 | - |
dc.subject.keywordAuthor | Thermal shock test | - |
dc.subject.keywordAuthor | Mechanical bonding strength | - |
dc.subject.keywordAuthor | Lead-free solder | - |
dc.subject.keywordAuthor | Automotive application component | - |
dc.subject.keywordAuthor | Error range | - |
dc.subject.keywordAuthor | Reliability evaluation | - |
dc.description.journalRegisteredClass | kci | - |
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