Sn-3Ag-0.5Cu계 솔더를 이용한 자동차 전장 부품 접합부의 열충격 특성에 관한 연구A Study of Thermal Shock Characteristics on the Joints of Automotive Application Component using Sn-3Ag-0.5Cu Solder
- Authors
- 전유재; 손선익; 김도석; 신영의
- Issue Date
- 2010
- Publisher
- 한국전기전자재료학회
- Keywords
- Thermal shock test; Shear strength test; Lead-free solder; Automotive application component; Reflow
- Citation
- 전기전자재료학회논문지, v.23, no.8, pp 611 - 616
- Pages
- 6
- Journal Title
- 전기전자재료학회논문지
- Volume
- 23
- Number
- 8
- Start Page
- 611
- End Page
- 616
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/36235
- ISSN
- 1226-7945
- Abstract
- This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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