폴리아닐린-실리카 복합체의 전기전도도와 경도에 대한 열처리 효과

Abstract

Physical stability of conducting polymers is considerably important for their applications in electronics. Here, we studied the thermal annealing effects of conducting polyaniline (PANI) composites with a sol-gel silica on their mechanical and electrical properties. Films were prepared onto a substrate by simple drop-casting method using solutions including aniline, tetraethyl orthosilicate (TEOS), and ammonium persulfate. Spectroscopic analyses confirm the emeraldine-salt phase of PANI and the presence of silica network in the film. Nanoindentation measurement showed that, although the improvement was observed in the PANI/TEOS hybrid films, the annealing temperature was not a significant factor for the hardness. The electrical conductivity of the composite decreased from 5.5 to 1.9 S/cm after annealing, due to the slight dedoping of PANI by heat-induced removal of the HCl dopant.