A novel method for Cu electrodeposition on indium tin oxide aided by two-step Sn-Pd activation

Abstract

Surface modification using the two-step wet activation method consisting of Sri sensitization and Pd activation was introduced to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse cluster-type deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and (111)-predominant Cu films on seedless ITO substrate.