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Silver direct electrodeposition on Ru thin films

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dc.contributor.authorKoo, Hyo-Chol-
dc.contributor.authorCho, Sung Ki-
dc.contributor.authorLee, Chang Hwa-
dc.contributor.authorKim, Soo-Kil-
dc.contributor.authorKwon, Oh Joong-
dc.contributor.authorKim, Jae Jeong-
dc.date.available2020-07-29T06:20:56Z-
dc.date.issued2008-05-
dc.identifier.issn0013-4651-
dc.identifier.issn1945-7111-
dc.identifier.urihttps://scholarworks.bwise.kr/cau/handle/2019.sw.cau/42465-
dc.description.abstractElectrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed initial population of Ag particles, and as a result a smooth film was obtained. (C) 2008 The Electrochemical Society.-
dc.language영어-
dc.language.isoENG-
dc.publisherELECTROCHEMICAL SOC INC-
dc.titleSilver direct electrodeposition on Ru thin films-
dc.typeArticle-
dc.identifier.doi10.1149/1.2890394-
dc.identifier.bibliographicCitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp D389 - D394-
dc.description.isOpenAccessN-
dc.identifier.wosid000254779700039-
dc.identifier.scopusid2-s2.0-41849146799-
dc.citation.endPageD394-
dc.citation.number5-
dc.citation.startPageD389-
dc.citation.titleJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.citation.volume155-
dc.type.docTypeArticle-
dc.publisher.location미국-
dc.subject.keywordPlusDIRECT COPPER ELECTRODEPOSITION-
dc.subject.keywordPlusCHEMICAL-VAPOR-DEPOSITION-
dc.subject.keywordPlusATOMIC LAYER DEPOSITION-
dc.subject.keywordPlusDIFFUSION BARRIER-
dc.subject.keywordPlusCU METALLIZATION-
dc.subject.keywordPlusRUTHENIUM-
dc.subject.keywordPlusNUCLEATION-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordPlusTIN-
dc.subject.keywordPlusADHESION-
dc.relation.journalResearchAreaElectrochemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryElectrochemistry-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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