Silver direct electrodeposition on Ru thin films
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Koo, Hyo-Chol | - |
dc.contributor.author | Cho, Sung Ki | - |
dc.contributor.author | Lee, Chang Hwa | - |
dc.contributor.author | Kim, Soo-Kil | - |
dc.contributor.author | Kwon, Oh Joong | - |
dc.contributor.author | Kim, Jae Jeong | - |
dc.date.available | 2020-07-29T06:20:56Z | - |
dc.date.issued | 2008-05 | - |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.issn | 1945-7111 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/42465 | - |
dc.description.abstract | Electrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed initial population of Ag particles, and as a result a smooth film was obtained. (C) 2008 The Electrochemical Society. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.title | Silver direct electrodeposition on Ru thin films | - |
dc.type | Article | - |
dc.identifier.doi | 10.1149/1.2890394 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp D389 - D394 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000254779700039 | - |
dc.identifier.scopusid | 2-s2.0-41849146799 | - |
dc.citation.endPage | D394 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | D389 | - |
dc.citation.title | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | - |
dc.citation.volume | 155 | - |
dc.type.docType | Article | - |
dc.publisher.location | 미국 | - |
dc.subject.keywordPlus | DIRECT COPPER ELECTRODEPOSITION | - |
dc.subject.keywordPlus | CHEMICAL-VAPOR-DEPOSITION | - |
dc.subject.keywordPlus | ATOMIC LAYER DEPOSITION | - |
dc.subject.keywordPlus | DIFFUSION BARRIER | - |
dc.subject.keywordPlus | CU METALLIZATION | - |
dc.subject.keywordPlus | RUTHENIUM | - |
dc.subject.keywordPlus | NUCLEATION | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | TIN | - |
dc.subject.keywordPlus | ADHESION | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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