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Designing the shape of supraparticles by controlling the apparent contact angle and contact line friction of droplets

Authors
Kim, JihyeHwang, HyesunButt, Hans-JuergenWooh, Sanghyuk
Issue Date
15-Apr-2021
Publisher
ACADEMIC PRESS INC ELSEVIER SCIENCE
Keywords
Supraparticle; Surface-templated synthesis; Colloidal self-assembly; Droplet contact friction
Citation
JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.588, pp 157 - 163
Pages
7
Journal Title
JOURNAL OF COLLOID AND INTERFACE SCIENCE
Volume
588
Start Page
157
End Page
163
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/48062
DOI
10.1016/j.jcis.2020.12.072
ISSN
0021-9797
1095-7103
Abstract
Surface-templated evaporation-driven supraparticle synthesis is a versatile method for supraparticle fabrication. A supraparticle is formed by drying droplet of a colloidal dispersion on liquid repellent surfaces, allowing precise control of the size and mean composition of the supraparticles. The crucial factor determining the morphology is the motion of the contact line of the dispersion droplet on the liquid repellent surface. Here, we study effects of (i) the apparent contact angle and (ii) the contact line friction of a droplet on the shape of the supraparticle. In order to change the initial apparent contact angle of the dispersion droplet a surfactant was added to decrease surface tension. In addition, two different liquid repellent surfaces were used: a polydimethysiloxane (PDMS) grafted surface and a lubricated surface. Both surfaces exhibited distinctly different contact line friction during evaporation. As the initial contact angle of a droplet decreases and friction of a contact line increases, flatter supraparticles are fabricated. By using this simple manipulation principle, eventually, various shapes of supraparticles can be obtained, such as mushroom, hemispherical, convex lens, and disk shapes. This study presents fundamental and critical information that allow us to manipulate the shape of a supraparticle via surface-templated evaporation-driven synthesis that increases the scalability of supraparticles for use in a wide range of applications. (c) 2020 Published by Elsevier Inc.
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공과대학 (화학공학과)
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