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Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 Μbga Solder 접합부의 열피로 수명예측
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김연성 | - |
| dc.contributor.author | 김형일 | - |
| dc.contributor.author | 김종민 | - |
| dc.contributor.author | 신영의 | - |
| dc.date.accessioned | 2021-10-27T05:40:14Z | - |
| dc.date.available | 2021-10-27T05:40:14Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.issn | 2466-2232 | - |
| dc.identifier.issn | 2466-2100 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/50810 | - |
| dc.format.extent | 7 | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 Μbga Solder 접합부의 열피로 수명예측 | - |
| dc.title.alternative | Prediction of Thermal Fatigue Life on μBGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys | - |
| dc.type | Article | - |
| dc.identifier.bibliographicCitation | 대한용접접합학회지, v.21, no.3, pp 92 - 98 | - |
| dc.identifier.kciid | ART000855332 | - |
| dc.description.isOpenAccess | N | - |
| dc.citation.endPage | 98 | - |
| dc.citation.number | 3 | - |
| dc.citation.startPage | 92 | - |
| dc.citation.title | 대한용접접합학회지 | - |
| dc.citation.volume | 21 | - |
| dc.publisher.location | 대한민국 | - |
| dc.description.journalRegisteredClass | kci | - |
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