Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application
DC Field | Value | Language |
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dc.contributor.author | Lee, Hyun-Shik | - |
dc.contributor.author | An, Shinmo | - |
dc.contributor.author | Kim, Young | - |
dc.contributor.author | Kim, Do-Kyoon | - |
dc.contributor.author | Kang, Jin-Ku | - |
dc.contributor.author | Choi, Young-Wan | - |
dc.contributor.author | Lee, Seung Gol | - |
dc.contributor.author | O, Beom Hoan | - |
dc.contributor.author | Lee, El-Hang | - |
dc.date.accessioned | 2021-12-22T02:41:04Z | - |
dc.date.available | 2021-12-22T02:41:04Z | - |
dc.date.issued | 2006-04 | - |
dc.identifier.issn | 0167-9317 | - |
dc.identifier.issn | 1873-5568 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/52693 | - |
dc.description.abstract | We report on the fabrication of a polymer-based 2.5 Gbps x 4 channel optical interconnecting micro-module for optical printed circuit board (O-PCB) application. An optical waveguide array is used for optical transmission from vertical surface emitting laser (VCSEL) array to photodiode (PD) array and the built-in 45 degrees waveguide mirrors are used for vertical coupling. The optical waveguide array and the 45 degrees mirrors are fabricated by UV imprint process in one-step. We fabricate microlensed VCSELs by micro-inkjetting method, which reduced radiation angle of VCSEL from 18 degrees to 15 degrees for better light coupling. We use solder ball array and pin array for alignment between O-PCB and the electrical sub-boards with alignment mismatch below 10 mu m in x, y and z axis. The fabricated optical interconnection module transmits data at the rate of 2.5 Gbps per channel. (c) 2006 Elsevier B.V. All rights reserved. | - |
dc.format.extent | 5 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.title | Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.mee.2006.01.118 | - |
dc.identifier.bibliographicCitation | MICROELECTRONIC ENGINEERING, v.83, no.4-9, pp 1347 - 1351 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000237581900175 | - |
dc.identifier.scopusid | 2-s2.0-33748258053 | - |
dc.citation.endPage | 1351 | - |
dc.citation.number | 4-9 | - |
dc.citation.startPage | 1347 | - |
dc.citation.title | MICROELECTRONIC ENGINEERING | - |
dc.citation.volume | 83 | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.publisher.location | 네델란드 | - |
dc.subject.keywordAuthor | optical interconnection | - |
dc.subject.keywordAuthor | photonic integrated circuit | - |
dc.subject.keywordAuthor | micro-fabrication | - |
dc.subject.keywordAuthor | UV embossing | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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