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Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis
Shin, YE; Lee, KW;
Chang, KH
; Jung, SB; Jung, JP
Article
Issue Date
2001
Citation
MATERIALS TRANSACTIONS, v.42, no.5, pp 809 - 813
Publisher
JAPAN INST METALS
1
Discover
Author
Jung, SB
1
Chang, Kyong Ho
1
Lee, KW
1
Shin, Young Eui
1
Subject
CHIP
1
finite element method
1
lead-free solder
1
PACKAGES
1
solder joint
1
thermal fatigue life
1
Date Issued
2001
1
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Article
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ENG
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