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Results 1-1 of 1 (Search time: 0.003 seconds).
Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5Ag-0.75Cu solder
open access
Lee, CB; Jung, SB; Shin, YE; Shur, CC
Article
Issue Date
2002
Citation
MATERIALS TRANSACTIONS, v.43, no.8, pp 1858 - 1863
Publisher
JAPAN INST METALS
1
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Author
Jung, SB
1
Lee, CB
1
Shur, CC
1
Shin, Young Eui
1
Subject
AG EUTECTIC SOLDER
1
ball shear test
1
CU SUBSTRATE
1
FLIP-CHIP TECHNOLOGY
1
fracture surface
1
INTERMETALLIC GROWTH
1
isothermal aging
1
LEAD-FREE SOLDERS
1
METALLIZATION
1
MICROSTRUCTURE
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