Micro/nano-scale integration of polymer optical wires and miniaturized photonic devices for optical printed circuit board (O-PCB) and VLSI photonic applications
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, E.-H. | - |
dc.contributor.author | Lee, S.G. | - |
dc.contributor.author | O, B.H. | - |
dc.contributor.author | Park, S.G. | - |
dc.contributor.author | Kim, K.H. | - |
dc.contributor.author | Kwon, Y.K. | - |
dc.contributor.author | Chin, I.-J. | - |
dc.contributor.author | Choi, Y.W. | - |
dc.contributor.author | Song, S.H. | - |
dc.date.accessioned | 2022-04-12T07:40:12Z | - |
dc.date.available | 2022-04-12T07:40:12Z | - |
dc.date.issued | 2005-11 | - |
dc.identifier.issn | 0277-786X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/56291 | - |
dc.description.abstract | We describe our work on the micro/nano-scale design and integration of polymer optical waveguide wires and miniaturized optical devices for applications in an optical module system that we call optical printed circuit board (O-PCBs) and VLSI photonic integrated circuits. We fabricate the O-PCBs using planar arrays of polymer waveguides to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. The VLSI photonic integrated circuits are designned to perform similar functions on a chip scale. We fabricate the polymer waveguides using thermal or ultra-violet (UV) embossing and imprinting technique. The optical boards which have 2-dimensional array of waveguides are attached to the electrical printed circuit board (E-PCBs) which carry the transmitter circuits and the receiver circuits of 2.5 Gbps or 10Gbps. In order to increase the efficiency of lightwave coupling between the lasers and the waveguide, we perform the alignment experiment between the laser and the waveguide via microlens and between the waveguide and the detector via microlens. The microlenses are fabricated by placing droppings of resins. Also, the 45-degree mirror to couple the light between the laser and the waveguide and the waveguide and the detector are fabricated by embossing technique to reduce the processing steps and for low-cost production purpose. For VLSI nano-scale photonic integration, we use photonic band-gap crystals and plasmonic waveguide structures. We discuss scientific issues and technological issues concerning the integration of micro- and nano-photonic devices and circuits. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | SPIE | - |
dc.title | Micro/nano-scale integration of polymer optical wires and miniaturized photonic devices for optical printed circuit board (O-PCB) and VLSI photonic applications | - |
dc.type | Article | - |
dc.identifier.doi | 10.1117/12.633968 | - |
dc.identifier.bibliographicCitation | Proceedings of SPIE - The International Society for Optical Engineering, v.6019 I | - |
dc.description.isOpenAccess | N | - |
dc.identifier.scopusid | 2-s2.0-33644930066 | - |
dc.citation.title | Proceedings of SPIE - The International Society for Optical Engineering | - |
dc.citation.volume | 6019 I | - |
dc.type.docType | Conference Paper | - |
dc.publisher.location | 미국 | - |
dc.subject.keywordAuthor | Microphotonics | - |
dc.subject.keywordAuthor | Nanophotonics | - |
dc.subject.keywordAuthor | Optical Interconnection | - |
dc.subject.keywordAuthor | Photonic Crystal | - |
dc.subject.keywordAuthor | Photonic Integration | - |
dc.subject.keywordPlus | Energy gap | - |
dc.subject.keywordPlus | Lenses | - |
dc.subject.keywordPlus | Optical devices | - |
dc.subject.keywordPlus | Optical interconnects | - |
dc.subject.keywordPlus | Printed circuit boards | - |
dc.subject.keywordPlus | VLSI circuits | - |
dc.subject.keywordPlus | Microphotonics | - |
dc.subject.keywordPlus | Nanophotonics | - |
dc.subject.keywordPlus | Photonic Crystal | - |
dc.subject.keywordPlus | Photonic Integration | - |
dc.subject.keywordPlus | Optical waveguides | - |
dc.description.journalRegisteredClass | scopus | - |
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