Agglomeration characteristic of particles in alumina slurry by addition of chemicals and milling process for CuCMP
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, M.H. | - |
dc.contributor.author | Kim, N.H. | - |
dc.contributor.author | Lim, J.H. | - |
dc.contributor.author | Kim, S.Y. | - |
dc.contributor.author | Chang, E.G. | - |
dc.date.accessioned | 2023-03-09T00:41:11Z | - |
dc.date.available | 2023-03-09T00:41:11Z | - |
dc.date.issued | 2005-04 | - |
dc.identifier.issn | 0921-5107 | - |
dc.identifier.issn | 1873-4944 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/65526 | - |
dc.description.abstract | Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. It is generally known that the implementation of optimum slurry composition is one of the important issues. In this experiment, we observed and analyzed the variation by the addition of chemicals and milling time of Cu CMP slurry. The particle size in slurry has influence on polishing rate and defect. The particles with milling process were assayed with the elapse of time and addition of chemical additives. The results showed that the particle size in slurry became smaller by increasing of bead amount and milling time. Additional milling time was appended to examine agglomeration of particle by milling time. The particle size after milling process became bigger with the increase of time due to absence of dispersion stability. It was confirmed that viscosity and particle size increased sharply with addition of tartaric acid in slurry with alumina-C as abrasive. (c) 2005 Elsevier B.V. All rights reserved. | - |
dc.format.extent | 4 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.title | Agglomeration characteristic of particles in alumina slurry by addition of chemicals and milling process for CuCMP | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.mseb.2004.12.059 | - |
dc.identifier.bibliographicCitation | MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.118, no.1-3, pp 306 - 309 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000228514800065 | - |
dc.identifier.scopusid | 2-s2.0-15344341762 | - |
dc.citation.endPage | 309 | - |
dc.citation.number | 1-3 | - |
dc.citation.startPage | 306 | - |
dc.citation.title | MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | - |
dc.citation.volume | 118 | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.publisher.location | 네델란드 | - |
dc.subject.keywordAuthor | chemical mechanical polishing | - |
dc.subject.keywordAuthor | particle size | - |
dc.subject.keywordAuthor | milling process | - |
dc.subject.keywordAuthor | agglomeration | - |
dc.subject.keywordPlus | MECHANICAL PLANARIZATION | - |
dc.subject.keywordPlus | COPPER | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
84, Heukseok-ro, Dongjak-gu, Seoul, Republic of Korea (06974)02-820-6194
COPYRIGHT 2019 Chung-Ang University All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.