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Melting and breaking of ultrathin copper nanobridges

Authors
Hwang, HJKang, JW
Issue Date
Jun-2003
Publisher
ELSEVIER SCIENCE BV
Keywords
molecular dynamics; copper; surface melting
Citation
SURFACE SCIENCE, v.532-535, pp 536 - 543
Pages
8
Journal Title
SURFACE SCIENCE
Volume
532-535
Start Page
536
End Page
543
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/65661
DOI
10.1016/S0039-6028(03)00166-3
ISSN
0039-6028
1879-2758
Abstract
Thermal properties of Cu nanobridges were investigated using a classical molecular dynamics simulation and a many-body potential function of the second-moment approximation of tight-binding scheme. The caloric curve and the diffusivity of nanobridges showed the information on the melting and breaking of nanobridges. (C) 2003 Elsevier Science B.V. All rights reserved.
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