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플립 칩 솔더 범프의 접합강도와 금속간 화합물의 시효처리 특성
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김경섭 | - |
| dc.contributor.author | 장의구 | - |
| dc.contributor.author | 선용빈 | - |
| dc.date.accessioned | 2023-03-09T03:44:08Z | - |
| dc.date.available | 2023-03-09T03:44:08Z | - |
| dc.date.issued | 2002 | - |
| dc.identifier.issn | 1226-9360 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/66164 | - |
| dc.format.extent | 36 | - |
| dc.publisher | 한국마이크로전자및패키징학회 | - |
| dc.title | 플립 칩 솔더 범프의 접합강도와 금속간 화합물의 시효처리 특성 | - |
| dc.title.alternative | Aging Characteristic of Intermetallic Compounds and BondingStrength of Flip-Chip Solder Bump | - |
| dc.type | Article | - |
| dc.identifier.bibliographicCitation | 마이크로전자 및 패키징학회지, v.9, no.1, pp 6 - 41 | - |
| dc.identifier.kciid | ART000863609 | - |
| dc.description.isOpenAccess | N | - |
| dc.citation.endPage | 41 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 6 | - |
| dc.citation.title | 마이크로전자 및 패키징학회지 | - |
| dc.citation.volume | 9 | - |
| dc.publisher.location | 대한민국 | - |
| dc.description.journalRegisteredClass | kciCandi | - |
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