Highly thermally conductive and insulating composites fabricated through the hot-pressing of hollow structured h-BN/rGO hybrid filler
DC Field | Value | Language |
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dc.contributor.author | Cho, Jangwoo | - |
dc.contributor.author | Su, Pei-Chen | - |
dc.contributor.author | Kim, Jooheon | - |
dc.date.accessioned | 2024-03-28T03:00:20Z | - |
dc.date.available | 2024-03-28T03:00:20Z | - |
dc.date.issued | 2024-04 | - |
dc.identifier.issn | 2352-9407 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/73040 | - |
dc.description.abstract | Polymer composites have several advantages: affordability, ease of processing, and versatile applications. In this study, hexagonal boron nitride (h-BN)/epoxy spheres were fabricated using NaCl, then washing away the NaCl with water to create h-BN/epoxy hollow structures. Reduced graphene oxide (r-GO) was subsequently wrapped around these structures to produce h-BN/r-GO/epoxy hollow structures. These structures were then fabricated into composites through a hot pressing method involving high pressure and heat, which achieved a vertical alignment of the h-BN components to establish a heat transfer path, with r-GO evenly dispersed throughout. The thermal conductivity of the h-BN/r-GO/epoxy composite was measured as 4.12 W/m·K, representing a 2060 % increase compared to that of neat epoxy. Despite incorporating electrically conductive r-GO, the h-BN/r-GO/epoxy composite maintained its insulating properties. This is attributed to the even distribution of insulating h-BN within the h-BN/r-GO/epoxy hollow structures. © 2024 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Elsevier Ltd | - |
dc.title | Highly thermally conductive and insulating composites fabricated through the hot-pressing of hollow structured h-BN/rGO hybrid filler | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.apmt.2024.102149 | - |
dc.identifier.bibliographicCitation | Applied Materials Today, v.37 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 001209675100001 | - |
dc.identifier.scopusid | 2-s2.0-85186955858 | - |
dc.citation.title | Applied Materials Today | - |
dc.citation.volume | 37 | - |
dc.type.docType | Article | - |
dc.publisher.location | 네델란드 | - |
dc.subject.keywordAuthor | Hexagonal boron nitride | - |
dc.subject.keywordAuthor | Hybrid filler | - |
dc.subject.keywordAuthor | Reduced graphene oxide | - |
dc.subject.keywordAuthor | Thermal conductivity | - |
dc.subject.keywordAuthor | Volume resistivity | - |
dc.subject.keywordPlus | BORON-NITRIDE | - |
dc.subject.keywordPlus | NANOCOMPOSITES | - |
dc.subject.keywordPlus | ENHANCEMENT | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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