CAU Scholar's Space: Journal : Electronic Materials Letters

Electronic Materials Letters

Journal Title

Electronic Materials Letters

ISSN

E 2093-6788 | P 1738-8090

Publisher

대한금속·재료학회

Listed on(Coverage)

JCR	2009-2019
SJR	2009-2019
CiteScore	2011-2019
SCIE	2010-2021
SCOPUS	2017-2020
KCI(Ranking)	2009-2019
KCI	2013-2021
KCI(Candidate)	2008-2013

Active

Active
based on the information
- SCOPUS:2020-10

Country

SOUTH KOREA

Article List

1 - 3 out of 3 results.

Device Failure Analysis with Epi-Si Wafer using Raman Shift Matching Method

Tae Min Choi; Eunmi Choi; JinUk Yoo; Eun Su Jung; Hwa Rim Lee; Songhun Yoon; Sung Gyu Pyo

ArticleIssue Date2025CitationElectronic Materials Letters, v.21, no.4, pp 532 - 539Publisher대한금속·재료학회

3D Integrated Process and Hybrid Bonding of High Bandwidth Memory (HBM)

Lee, Chae Yeon; Won, Chae Ho; Jung, Seyeon; Jung, Eun Su; Choi, Tae Min; Lee, Hwa Rim; Yoo, JinUk; Yoon, Songhun; Pyo, Sung Gyu

ArticleIssue Date2025CitationElectronic Materials Letters, v.21, no.3, pp 395 - 419PublisherKorean Institute of Metals and Materials

Device Failure Analysis with Epi-Si Wafer Using Raman Shift Matching Method

Choi, Tae Min; Choi, Eunmi; Yoo, Jinuk; Jung, Eun Su; Lee, Hwa Rim; Yoon, Songhun; Pyo, Sung Gyu

ArticleIssue Date2025CitationELECTRONIC MATERIALS LETTERSPublisherKOREAN INST METALS MATERIALS

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