CAU Scholar's Space: Lee, Seong Hyuk

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Lee, Seong Hyuk (이성혁)

공과대학 (기계공학부)

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Tel 02-820-5254
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Droplet:12||computational fluid dynamics (CFD):11||Heat transfer:10||Computational fluid dynamics:10||Evaporation:9||CFD:8||Computational fluid dynamics (CFD):7||전산유체역학:7||Contact angle:5||wettability:5||액적:5||coalescence:4||lowmeltingpoint alloy:4||Anodization:4||Nanofluid:4||Impact:4||증발:4||Computational Fluid Dynamics:4||Surface plasmon resonance:3||impingement:3||selforganized interconnection:3||열전달:3||구난역:3||Combined Cycle Power Plant:3||Coalescence:3||나노유체:3||소수성:3||deposition:3||heat transfer:3||Droplet evaporation:3||computational fluid dynamics:3||splash:3||wave interference:3||fluxing capability:3||화염 스프레이:3||droplet evaporation (액적 증발):3||Spanwise pressure gradient:2||Spectral solar radiation:2||전산유체해석:2||접촉각:2||nonequilibrium:2||nonequilibrium energy transfer:2||operating temperature:2||Heating element:2||particle behavior:2||충돌:2||Spread:2||Spreading:2||electrolyte thickness:2||Electrostatic chuck:2||Stanton number:2||pressure regulating station:2||터널화재:2||pressure regulator:2||Bimetallic:2||Flame Spray:2||Water electrification:2||Confined Space:2||퍼짐:2||Leakage characteristics:2||Gas Leakage:2||Energy harvesting:2||Longitudinal vortex:2||femtosecond pulse laser:2||미세 금속 입자:2||rebound:2||Rescue Station:2||Rescue station:2||Lower Flammable Limit:2||safety valve:2||ablation:2||Surface plasmon resonance imaging:2||Hydrophilic:2||Hydrophobic:2||Oxinitriding:2||Ceramic heater:2||Temperature uniformity:2||Hydrophobicity:2||Metamodel:2||Textured surface:2||atomization:2||SRV(Optimol SRV):2||Passenger compartment:2||산질화:2||Selective evaporation:2||carrier temperature:2||MicroMetal Particle:2||Microtexture:2||Conjugate heat transfer:2||Smoke Propagation:2||coating:2||Impinging:2||thermal spray:2||thermal spraying:2||computational fluid dynamics (전산유체역학):2||low melting point alloy (LMPA):2||tinbismuth:2||Dropwise condensation:2||Contact line motion:2||Triboelectric nanogenerator:2||Tunnel Fire:2||Tunnel fire:2||Turbulent boundary layer:2||Colburn jfactor:2||Fire scenario:1||Fire simulation:1||Flame Spraying:1||Flame Spread Rate:1||Flammability Limit:1||Flammable region:1||Flammable region aspect ratio:1||Flip chip:1||Flip chip packaging:1||Fluid analysis:1||Fluid dynamic:1||Fluid flow:1||Fluid viscosity:1||FokkerPlanck Equation:1||Forest Fire:1||Freepiston Stirling cooler (FPSC):1||Friction Reduction:1||Friction factor:1||Frost thin layer:1||Frosting process:1||Fuel Type:1||Fuel droplet:1||Full width half maximum:1||Gas Dispersion:1||Gas turbine:1||Gerbil:1||Glacierice exploration:1||Glass Deformation:1||Glass backplane:1||Global Reaction:1||HVAC:1||Hazardous and noxious substance:1||Hazardous and noxious substance (HNS):1||Hazardous and noxius substance:1||Hazardous noxious substance:1||Heat flux:1||Heat release rate:1||Heated surface:1||Heating ventilation and air conditioning (HVAC) system:1||Height of grassland:1||High rise building:1||Highspeed:1||Hindered Brownian motion:1||Hole position:1||Hot plume:1||Hot steel plate:1||Hybrid:1||Hydrogen:1||Hydrophobic surface:1||Illumination path:1||Impingement:1||Impinging Droplet:1||Impinging Sprays:1||Impinging droplet:1||Insitu measurements:1||Inclined Wall:1||Injection type:1||Interface/interphase:1||Intermetallic compound:1||Joule Heating:1||Jouleheating:1||Jouleheating induced crystallization:1||Kretschmann surface plasmon resonance (SPR) sensor:1||Kriging model:1||LNG:1||Laser Fluence:1||Laser ablation:1||Leadfree solder:1||Leakage Hole:1||Leakage distance:1||Local mass flux:1||Lower flammable limit:1||Lubrication:1||MVHS 모델:1||MVHS(Modified Volumetric Heat Source) Model:1||Melting dynamics:1||Methanesteam reforming:1||Micro Dimple:1||Modeling:1||Modified VHS Model:1||Modified VHS model:1||Modified VHS 모델:1||Mole Fraction:1||Monolayer:1||Movable liquid electrode:1||MultiPhase Flow:1||Multiple Beam Interference Matrix:1||Multiple beam interference matrix:1||Nano particle:1||Nanofluid thin layer:1||Nanoparticle:1||Nanoparticle deposition:1||Noise barrier:1||NonNewtonian:1||NonStaggered Grid:1||Nonequilibrium Energy Transfer:1||Noninvasive:1||Nucleation:1||Numerical analysis:1||Numerical simulation:1||OLED Display Backplane:1||OLED 디스플레이 기판:1||Obstacle Effect:1||Offset distance:1||Optical Characteristic:1||Ovalshape model:1||Particle Collection:1||Particle size:1||Particle transport:1||Perimeter:1||Periodic Body Acceleration:1||Permeability:1||Phase Shift:1||Phase transformation:1||Phase transition:1||Pinning:1||Plate heat exchanger:1||Poly(Nisopropylacrylamide) (pNIPAM):1||Polycrystalline silicon:1||Porous Air Bearing:1||Porous catalytic medium:1||Propagation behavior:1||Propagation velocity:1||Pulsatile Flow:1||QFP:1||QRA:1||Quenching:1||Radial tension:1||Rayleigh number (레일리 수):1||Rebound:1||Recede:1||Receding:1||Recombination:1||Reduced model:1||Reflectance:1||Reflectivity:1||Refuse safety area:1||Reliability:1||Reynolds stress model (RSM):1||Reynoldsaveraged NavierStokes:1||Reynoldsaveraged NavierStokes (RANS):1||Rib turbulator:1||Roughness Effect:1||SMT electronic device:1||SMT 전자부품:1||SRH (ShockelyReadHall):1||Scattering dust:1||Selfpackaging design:1||Shock Wave:1||Silicon Crystallization:1||Silicon crystallization:1||Simulation:1||Smoke concentration:1||Smoke control system:1||Smoke movement:1||Smoke propagation:1||Sn0.3Sb0.4Ag37.4Pb:1||Sn3Ag0.5Cu:1||SnBi:1||SnIn:1||Solar energy:1||Solid oxide fuel cell:1||Spatial nonuniformity:1||Splash:1||Spray:1||Spray Distance:1||Spray Penetration Length:1||Spreading distance:1||Steam reforming:1||SteamCarbon Ratio:1||Steammethane reforming:1||Stiffness:1||Stretching Separation:1||Structure analysis:1||Subcooled water jet impingement:1||Superhydrophobic surface:1||Surface Plasmon Resonance:1||Surface energy:1||Surface homogeneity:1||Surface plasmon resonance (SPR):1||Surface plasmon resonance imaging (SPRi):1||Surface treatment:1||Surface wettability:1||Swirling flows:1||Temporal resolution:1||Terminal Electrostatic Velocity:1||Thermal analysis:1||Thermal characteristics:1||Thermal comfort:1||Thermal deformation:1||Thermal deformation.:1||Thermal nonequilibrium model:1||Thermal resistance:1||Thermal spray:1||Thickness measurement:1||Thin Film:1||Thin film measurement:1||Threshold:1||Throughhole:1||Total evaporation time:1||Total internal reflection fluorescence microscopy:1||Transition film:1||Transmittance:1||TwoTemperature Model:1||UltraHigh Pressure:1||Underfill:1||Underground Combined Cycle Power Plant:1||Underground space:1||Unsteady Flow:1||User Defined Function:1||Ventilation system:1||Verticalcavity surfaceemitting lasers (VCSELs):1||Volatile organic compounds:1||Volume Fraction:1||Volume of fluid:1||Volume of fluid (VOF):1||Volumetric heat source(VHS):1||WFDS:1||Wall Shear Stress:1||Water spraycooling:1||Wave Interference:1||Weber Number:1||Weber number:1||Wenzel:1||Wind velocity:1||Windbreak wall:1||XPS:1||Yield rate:1||Yttriastabilized zirconia (YSZ):1||acoustic phonon:1||acoustic phonons:1||adhesive strength:1||anisotropic conductive adhesive:1||anisotropic conductive adhesive (ACA):1||anisotropic conductive film (ACF):1||anisotropy:1||annealing:1||anodized aluminum:1||auger recombination:1||avalanche:1||binary mixture droplet (이종혼합물 액적):1||cable fire:1||carrier density:1||carriers:1||cathodesupported solid oxide fuel cells:1||characteristic transmission matrix (CTM) method:1||closecontact melting (CCM):1||collision:1||computational fluid
dynamics:1||concentration measurement (농도 측정):1||conduction path:1||conductive adhesive:1||continuum surface force (CSF) model:1||crack:1||crater:1||creep:1||crystallization:1||curvature:1||deposition angle:1||design technology:1||diesel engine:1||diesel engines:1||direct injection:1||directbandgap:1||droplet:1||droplet pillar array:1||dynamic contact angle (DCA):1||effective thermal conductivity:1||electrically:1||electrothermal drilling probe (ETDP):1||electromagnetic theory:1||electronphonon coupling factor:1||electronphonon coupling factor (Gfactor):1||encapsulation:1||energy harvesting:1||energy transport:1||enhancement of magnetic field intensity:1||evaporation:1||evaporation rate (증발률):1||fan speed:1||femtosecond laser:1||filling time:1||film:1||finnedtube heat exchanger:1||fire propagation:1||fire simulation:1||fixedbed reactor:1||flattening:1||flip chip:1||flipchip packaging:1||fluxing capacity:1||free convection (자연 대류):1||free convection (자연대류):1||friction factor:1||full width at half maximum (FWHM):1||gallium arsenide (GaAs):1||gas leakage:1||grain growth:1||grid sensitivity:1||hazardous noxious substance (HNS):1||heat and mass transfer:1||heat treatment furnace:1||honeycomb:1||hydrophobic surface:1||indirectbandgap:1||infiltration:1||interspray impingement:1||interdroplet ice bridging:1||interfacial region:1||intermetallic compounds:1||isotropic conductive adhesive:1||laser surface texturing:1||lattice temperature:1||linear reciprocating tests:1||liquid crystal display (LCD):1||longitudinal optical (LO) phonons:1||low temperature solid oxide fuel cells:1||lowtemperature microsolid oxide fuel cell (LT muSOFC):1||metaldielectric interface:1||methanesteam reforming:1||micrometal particle:1||microscale heat transfer:1||multiwalled carbon nanotube (MWCNT):1||multiphoton ionization:1||nanoporous cathode:1||nanostructure:1||nanostructured superhydrophobic surface:1||nitrocarburizing:1||nonNewtonian fluid:1||nonequilibrium:1||nonequilibrium phase field model (NPFM):1||open rate:1||optical condition:1||optical phonon:1||optics:1||perforation:1||phase change:1||phase shift:1||phonon mean free path:1||platinum nickel alloy:1||preheating:1||pressurestrain correlation terms:1||propagation:1||propagation velocity:1||pulse train lasers:1||pulsed laser:1||pyrolysis:1||quad flat package (QFP):1||radial nanowire heterostructure (RNWHS):1||rate of penetration (ROP):1||regenerator:1||regression method:1||reliability:1||required effective discharge area:1||reynolds number:1||samariumdoped ceria:1||sauter mean diameter:1||secondary air:1||shearthinning:1||shock wave:1||short pulse lasers:1||silicon:1||silicon thin films:1||silver:1||solder:1||solderable conductive adhesive:1||solid oxide fuel cell (SOFC):1||solid oxide fuel cells:1||spray:1||spray penetration:1||spraying distance:1||sprays:1||steam reforming reaction:1||submicron layer:1||surface plasmon resonance imaging (SPRi):1||surface plasmon resonance imaging (표면플라즈몬공명 가시화):1||swirl number:1||switching time:1||temperature efficiency:1||temperature uniformity:1||thermal agglomeration:1||thermal boundary resistance (TBR):1||thermal characteristics:1||thermal property (열물성):1||thermoresponsive polymer:1||thermosonic bonding ultrasonic:1||thin film:1||thin film structure:1||thin films:1||three dimensional turbulent boundary layer (3DTBL):1||transport ship:1||triboelectric nanogenerator:1||turbulent normal stress:1||twotemperature model (TIM):1||ultrahigh injection pressure:1||ultrashort pulse:1||ultrafast laser:1||ultrashort pulse laser:1||ultrashort pulse train lasers:1||underventilated fires:1||underfill:1||viscosity:1||volume of fluid (VOF):1||wall spray:1||watermist:1||wave interference effect:1||wave model:1||weber number (We):1||wetting transition:1||가연 한계:1||가연영역:1||가열 표면:1||강성:1||건물일체형 태양광발전시스템:1||경사진 벽:1||고착:1||공간 화재:1||광학적 특성:1||극초고압:1||나노 입자:1||나노입자:1||내부식성:1||다공질 공기 베어링:1||다상유동:1||다중빔간섭행렬:1||당량비:1||둘레길이:1||레이저 표면 텍스처링:1||마찰 감소:1||맥동유동:1||미세 딤플:1||미세 텍스쳐:1||미세텍스쳐:1||박막:1||박막두께:1||반사율:1||발열량:1||방위각:1||방음벽:1||방풍력:1||벽전단응력:1||복합발전플랜트:1||부피비:1||분무:1||분무침투거리:1||분열:1||비등점:1||비산분진:1||비엇갈림 격자계:1||비정상유동:1||비평형 에너지 전달:1||사용자 정의 함수:1||산소저공급 화재:1||상차분모델:1||선형왕복시험:1||소수성 표면:1||솔더:1||스트레칭 분리:1||실내 화재:1||실리콘 결정화:1||쌍금속:1||액적 분열:1||액적 성장 거동:1||액적 응축:1||액적 증발:1||액적 충돌:1||액적 퍼짐:1||액화천연가스:1||양극 산화법:1||양극산화법:1||어블레이션:1||에디분열모델:1||연기 전파:1||연기거동:1||연기농도:1||연료 액적:1||연료 종류:1||열저항:1||오류확산:1||용사:1||용사 거리:1||워터미스트:1||웨버수:1||위상 변화:1||위험도 정량화 기법:1||유리 변형:1||윤활특성:1||응축 열전달:1||입자 이송:1||입자집진:1||저탄장:1||전기집진기:1||조도 효과:1||종단속도:1||주기가속도:1||줄 가열:1||지하공간:1||집진효율:1||체적열원:1||총괄 반응:1||축소 모델:1||충격파:1||충돌 액적:1||충돌분무:1||충돌액적:1||친수성:1||친수성소수성:1||크립:1||태양에너지:1||터널 화재:1||투과율:1||튐:1||특성전달행렬:1||파공크기:1||파쇄형상:1||파장 간섭:1||퍼짐거리:1||펨토초 레이저:1||평형 접촉각:1||포논 복사 전달 방정식:1||표면 플라즈몬 공명:1||피해 평가:1||합착:1||항력계수:1||환기 시스템:1||2온도 모델:1||흡수율:1||3 오메가 방법:1||3ω method:1||Ablation:1||Absorption Rate:1||Active particle manipulation:1||Aggregation:1||Air jet:1||Airborne virus concentrator:1||Amorphous silicon:1||Analytical modelling:1||Arch fiber:1||Auger heating:1||Average evaporation flux (AEF):1||Azimuth angle:1||BIPV(Building Integrated Photovoltaic System):1||Bandpass filter:1||Basilar membrane:1||Batch type:1||Binary mixture droplet:1||Binary mixture droplet (BMD):1||Binary mixture droplets:1||Boiling:1||Boiling heat transfer:1||Boiling temperature:1||Breakup:1||CFD (computational fluid dynamics):1||CFD(Computational Fluid Dynamics):1||CIP법:1||CO2 + THF hydrate:1||CO2 emission reduction:1||CO2 laser:1||Casimir theory:1||Cassie Baxter:1||Cathode polarization:1||Ceiling jet:1||Characteristic Transmission Matrix(CTM):1||Chemical reaction:1||Closecontactmelting (CCM):1||Coal storage pile:1||Cochlea:1||Collection Efficiency:1||Combined cycle power plant:1||Combustion products:1||Compartment fire:1||Compartment fires:1||Computational Fluid Dynamics (CFD):1||Concentration measurement:1||Condensation frosting:1||Condensation heat transfer:1||Confined space:1||Confinement effect:1||Consequence Analysis:1||Contact Angle:1||Contact line region:1||Contactless dielectrophoresis:1||Cooling channel:1||Cooling effectiveness:1||Corrosion resistance:1||Corrugation profile:1||Crack hole size:1||Crack size:1||Crater Shape:1||Cubic Interpolated Propagation Method:1||Deposition:1||Differential pressure:1||Diffusionlimited model:1||Direct current power:1||Discrete Phase Models:1||Discrete ordinates (DO) method:1||Displacement:1||Dissociation enthalpy:1||District cooling application:1||Drag Coefficient:1||Drilling:1||Droplet Breakup:1||Droplet Collision:1||Droplet Spreading:1||Droplet evaporation model:1||Droplet growth behavior:1||Dynamic contact angle:1||Dynamic mesh:1||Eddy breakup(EBU) Model:1||Edge shrinking velocity:1||Electrothermal probe:1||Electrostatic Precipitator:1||Electrostatic precipitator:1||Encapsulation:1||Enclosure Space:1||Engineering model:1||Equation of Phonon Radiative Transport(EPRT):1||Equilibrium Contact Angle:1||Equivalence Ratio:1||Evaporating thin film (ETF):1||Evaporation flux:1||FDS:1||False Diffusion:1||Femtosecond Laser:1||Femtosecond Laser:1||Filling time:1||Film Cooling:1||Film Thickness:1||Finite boundary limit:1||Fire model:1||

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