CAU Scholar's Space: Kim, Jong Min

Detailed Information

Kim, Jong Min (김종민)

공과대학 (기계공학부)

Research Area

Tel 02-820-5728
Homepage

ResearcherID ORCiD Scopus Google Scholar ID ResearchGate

Keyword

lowmeltingpoint alloy:10||Anisotropic conductive adhesive:6||Reliability:6||wettability:6||Wettability:5||coalescence:5||polymeric composites:5||electrically conductive adhesive (ECA):4||fluxing capability:4||selforganized interconnection:3||Multiwalled carbon nanotube:3||Nanobubble:3||Intermetallic compounds:3||underfill:3||Gasoline engine:2||low melting point alloy (LMPA):2||Flip chip:2||stress:2||sensitivity:2||High reliability:2||Lowmeltingpoint alloy:2||Hydrogen nanobubble:2||Lowmeltingpointalloy:2||Intermetallic compound:2||Mechanical strength:2||tinbismuth:2||intermetallics:2||ultrasonic sensor:2||membrane:2||Coalescence:2||selective wetting:2||Ultrasonic bonding:2||resonant frequency:2||QFP:2||computational fluid dynamics (CFD):2||Underfill:2||Isotropic conductive adhesive:2||Reductant:2||isotropically conductive adhesive (ICA):2||Reduction capability:2||Low melting point alloy:2||Low melting point solder:2||Gold (Au) bump:1||Highmeltingpoint  alloy  (HMPA):1||Hordeum vulgare L.:1||Humancentered robot:1||Hybrid actuation:1||Hydration:1||Hydrogen:1||Hydrogen nanobubble water:1||Hydrogengasoline blend:1||Injection type:1||Interconnection properties:1||Isotropic conductive adhesives:1||Leadfree solder:1||LowMeltingPoint Alloy:1||LowMeltingPoint Alloy(LMPA):1||Lowmelting point solder:1||Lowmeltingpoint  alloy  (LMPA):1||Magentic properties:1||Mortar:1||Movable liquid electrode:1||Multiwalled carbon nanotubes:1||Nanobubble stability:1||Nonconductive film:1||Nucleation:1||OEMCMs:1||Optimal jaw pressure:1||Optimization:1||Phase transition:1||Polymer composite:1||Polymeric composite:1||Polymeric composites:1||Protrusion jaw:1||Pull strength:1||Quad flat package (QFP):1||Reliability test:1||SMT electronic device:1||SMT 전자부품:1||SRH (ShockelyReadHall):1||SiC:1||Silicon (Si) wafer:1||Sn0.3Sb0.4Ag37.4Pb:1||Sn3Ag0.5Cu:1||SnBi:1||SnIn:1||SnZnBi solder:1||Surface analysis:1||Surface cleaning:1||Thermal properties:1||Toughness:1||Ultrasonication:1||Underfill flow:1||Underfill materials:1||Vertical alignment:1||Volume of fluid (VOF):1||Wetting:1||Wetting Coalescence:1||Zeta potential:1||acoustic phonons:1||anisotropic conductive adhesive:1||anisotropic conductive adhesive (ACA):1||anisotropic conductive film:1||anisotropic conductive film (ACF):1||anisotropic conductive films (ACFs):1||area array packaging:1||auger recombination:1||ball grid array package:1||carbon nanotuubes (CNTs):1||carriers:1||cement mixture:1||chiponfilm (COF):1||coating:1||conduction path:1||conductive adhesive:1||conductive path:1||continuum surface force (CSF) model:1||creep:1||curing behaviors:1||directbandgap:1||dynamic reactive wetting:1||elasticplasticcreep:1||electrically:1||electrically conductive paste:1||encapsulation:1||epoxy composites:1||epoxy resin:1||epoxy terminated siloxane:1||fatigue life:1||filling time:1||finite element analysis (FEA):1||flattening:1||flip chip:1||flipchip packaging:1||fluxing capacity:1||fluxless:1||fluxless bonding:1||fracture mode:1||gallium arsenide (GaAs):1||graphene:1||high reliability:1||highmeltingpoint alloy:1||hydrogen nanobubble water (HNBW):1||hysteresis model:1||indirectbandgap:1||intermetallic compounds:1||isotropic conductive adhesive:1||joint geometry:1||leadfree:1||leadfree solder:1||life prediction:1||longitudinal optical (LO) phonons:1||low melting point solder:1||low meltingpoint alloy (LMA):1||low process temperature:1||lowmeltingpoing alloy:1||material property:1||mechanical property:1||mechanical reliability:1||mechanical strength:1||micro ball grid array (mu BGA):1||microoptoelectromechanical systems (MOEMS):1||microelectromechanical systems (MEMS):1||nickel(phosphate)/gold coating:1||nonequilibrium phase field model (NPFM):1||nonequilibrium:1||optical condition:1||optoelectronic multichip modules (OEMCMs):1||passive alignment:1||preheating:1||pull strength:1||quad flat package (QFP):1||reductant:1||reinforcement particle:1||reliability:1||residual stress:1||selfalignment:1||selfinterconnection:1||short pulse lasers:1||silicon:1||solder:1||solderable conductive adhesive:1||steel pipe members:1||surface mount device:1||thermal shock:1||thermal spraying:1||thermomechanical reliability:1||thermosonic bonding:1||thermosonic bonding ultrasonic:1||threedimensional digital photogrammetry:1||tinsilvercopper alloy:1||ultrasonic vibration:1||viscoplastic:1||viscosity:1||visual monitoring system:1||volume of fluid (VOF):1||watertightness:1||weld metal:1||welded joint:1||welded member:1||zetaPotential:1||솔더:1||3D assembly:1||크립:1||Active particle manipulation:1||Air gas:1||Anisotropic conductive film:1||Area array packaging:1||Atmosphericpressure plasma treatment:1||AuZn IMC:1||BGA interconnection process:1||Barley seed:1||Bubble structure:1||Capillary flow:1||Carbon nanotube:1||Chemorheology:1||Chip on glass (COG):1||Combustion characteristic:1||Combustion characteristics:1||Composites:1||Computational fluid dynamics (CFD):1||Conduction  path:1||Contactless dielectrophoresis:1||Copper (Cu):1||Copper bump:1||Cu strengthening powder:1||Defect:1||Design methodology:1||Die shear test:1||Diesheartest:1||Electrical resistance:1||Electrically  conductive  adhesive  (ECA):1||Electrically Conductive Adhesive:1||Electrically Conductive Adhesive(ECA):1||Electrically conductive adhesive:1||Electronic device:1||Encapsulation:1||FEA:1||Filling time:1||Flip chip packaging:1||Flipchip:1||Flipchip packaging:1||Fluid filling time:1||Fracture mode:1||Germination test:1||

STATISTICS: Total View :6,928,534; Today View :2,928

RSS_1.0 RSS_2.0 ATOM_1.0

84, Heukseok-ro, Dongjak-gu, Seoul, Republic of Korea (06974)02-820-6194

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.

Detailed Information

Keyword

BROWSE