CAU Scholar's Space: Lee, Hyoung Soon

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Lee, Hyoung Soon (이형순)

공과대학 (기계공학부)

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Tel 02-820-5993
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Thermal management:5||Heat transfer:4||3D manifold:4||Artificial neural network:3||Condensation:3||thermal management:3||Micropin fin:3||Electronics cooling:2||Electrohydrodynamics:2||Pressure drop:2||pressure drop:2||Nusselt number:2||Multilayer perceptron:2||Copper inverse opals:1||Critical heat flux:1||Cryogenic Chamber:1||D. Nearjunction thermal transport:1||D. Thermal boundary resistance:1||D. Thermal conductivity:1||Diamond:1||Electrospray:1||Embedded cooling:1||Embedded microchannel:1||Energy harvesting:1||Ensemble learning:1||Fluorocarbon liquid:1||Freefalling:1||Gallium oxide (Ga2O3):1||Heat Exchanger:1||Heat exchange:1||Heat sinks:1||Hydrogen Components:1||Interface:1||Liquid pinning:1||Low surface tension liquids:1||Manifold microchannel:1||Meniscus formation:1||Microfluidic cooling:1||Monolithic microcooler:1||Noncondensable gas:1||Optimization:1||Passive containment cooling system:1||Phase change:1||Phase routing:1||Phasechange:1||Phonon heat conduction:1||Pool boiling:1||Random rough surface:1||Single droplet:1||Single jet:1||Singlephase water cooling experiments:1||Spray cooling:1||Thermal conductivity:1||Thermal performance index:1||Thinfilm evaporation:1||Twophase cooling:1||Unidirectional rough surface:1||Universal model:1||Water electrification:1||Wetting speed:1||binary mixture droplet (이종혼합물 액적):1||boiling:1||chip cooling:1||coldplate microchannel:1||concentration measurement (농도 측정):1||critical heat flux:1||diamond:1||droplet evaporation (액적 증발):1||embedded cooling:1||embedded microchannel:1||embedded microchannels:1||evaporative cooling:1||flexible electronics:1||flow boiling:1||friction factor:1||heat transfer:1||hierarchical structure:1||infrared (IR) measurement:1||laser ablation:1||laserinduced graphene:1||micropin fin array:1||microchannel:1||microdroplets:1||micropin fins:1||particle swarm optimization:1||porous carbon:1||porous copper:1||reduced order thermalfluidic model:1||singlephase R245fa:1||staggered:1||surface plasmon resonance imaging (표면플라즈몬공명 가시화):1||templated electrodeposition:1||thermal performance index:1||thermal resistance:1||twophase cooling:1||극저온 챔버:1||수소부품:1||3D ICs:1||열교환기:1||3D integrated circuit:1||3Dmanifold:1||A. GaNondiamond:1||Aircooled condensers:1||Bouncing dynamics:1||CFD:1||CFD Simulation:1||CFD 시뮬레이션:1||COP:1||Canthotaxis effect:1||Condensed droplet:1||Conjugate thermalfluidic numerical simulations:1||

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84, Heukseok-ro, Dongjak-gu, Seoul, Republic of Korea (06974)02-820-6194

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