CAU Scholar's Space: Lee, Hyoung Soon

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Lee, Hyoung Soon (이형순)

공과대학 (기계공학부)

Research Area: Fundamental studies of nano to macro-scale heat and mass transport, Material development for nano to macro-scale heat and mass transport, Development of Computational Fluid Dynamics(CFD) Modeling for Multi-phase Phenomena

Tel 02-820-5993
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Thermal management:14||Condensation:9||Heat transfer:8||3D manifold:6||Flow boiling:6||Electrohydrodynamics:5||Pressure drop:4||Annular flow:3||Waste heat recovery:3||Artificial neural network:3||Twophase cooling:3||Twophase boiling:3||Boilinginduced degradation:3||Thermal degradation:3||thermal management:3||Microgravity:3||porous copper:3||Micropin fin:3||Manifold microchannel:3||Capillary flow:3||Gas turbine:3||Electronics cooling:3||Energy efficiency:3||Data centers:3||Copper inverse opals:3||Copper inverse opal:3||embedded cooling:3||diamond:3||boiling:3||히트 파이프 열교환기:2||3D Silicon microchannel manifold:2||3D manifold microchannel:2||Boiling:2||CFD:2||CFD analysis:2||Corrosion:2||Critical heat flux:2||Deep learning:2||Eddy diffusivity:2||Embedded cooling:2||Erosion:2||Flexible electronics:2||Flow orientation:2||Heat Pipe Heat Exchanger:2||Heterogeneous integration:2||Horizontal flow:2||Interfacial behavior:2||Interfacial waves:2||Laserinduced graphene:2||Microchannel:2||Minichannel:2||Multilayer perceptron:2||Nickel inverse opal:2||NonEquilibrium Model:2||Numerical Simulation:2||Nusselt number:2||OnsagerWien effect:2||OpenFOAM:2||Optimization:2||Phase change:2||Pool boiling:2||Porous Media Model:2||Reduced gravity:2||Silicon microchannel fin array:2||Silicon microfabrication technology:2||Thermal conductivity:2||Twophase closed thermosyphon:2||annular flow:2||condensation:2||evaporation:2||heat transfer:2||high heat flux:2||largearea cooling:2||microfluidics:2||microgravity:2||pressure drop:2||다공성 매체 모델:2||비평형 모델:2||수치 해석:2||Flow condensation:1||3D ICs:1||Fluorocarbon liquid:1||Freefalling:1||GaNonSiC:1||Gallium oxide (Ga2O3):1||Capillary rate of rise:1||Heat Exchanger:1||열교환기:1||Heat exchange:1||Heat pipe heat exchanger:1||Heat sinks:1||Canthotaxis effect:1||Heating systems:1||micropin fins:1||Hierarchical structure:1||mistassisted film cooling:1||Hydrogen Components:1||Hydrogen storage:1||Hydrophilic surface:1||Hydrophobic surface:1||Hyperloop system:1||Immersed heat sink:1||Immersion cooling:1||Interface:1||multiscale modeling:1||Interfacial form drag:1||Interfacial viscous drag:1||organic synthesis:1||Laser machining:1||Laser powder bed fusion:1||Laser processing:1||Laser structuring:1||Laser texturing:1||overall efficiency:1||Liquid pinning:1||Local thermal nonequilibrium model:1||Low surface tension liquids:1||Machine learning:1||Mainstream turbulence:1||COP:1||Manifold microgap:1||Mass transfer intensity factor:1||Melting:1||Meniscus formation:1||Metals:1||oxygen evolution reaction:1||CFD 시뮬레이션:1||Micropin fin heat sink:1||Microchannel:1||Microchannel heat sink:1||Microfluidic cooling:1||CFD Simulation:1||Microporous surface:1||particle swarm optimization:1||Monolithic microcooler:1||Multielement interaction:1||phase change materials:1||Multimodal:1||Neural networks:1||phase separation:1||Noise reduction:1||porous carbon:1||Noncondensable gas:1||3Dmanifold:1||Nusselt model:1||수소부품:1||reduced order thermalfluidic model:1||shock wave:1||singlephase R245fa:1||Passive containment cooling system:1||sphere:1||Phase change materials:1||Phase routing:1||Phase separation:1||Phasechange:1||Phasechange material:1||Phasechange model:1||Phonon heat conduction:1||Physicsconstrained:1||Pneumatic artificial muscle:1||Pneumatic device:1||staggered:1||Porous Copper Inverse Opals:1||surface plasmon resonance imaging (표면플라즈몬공명 가시화):1||Porous graphene:1||Porous media model:1||Porous metal surface:1||Porous metal surfaces:1||Bubble nucleation:1||Pressure wave:1||Projectile launch:1||Random rough surface:1||Ratedependent adhesion:1||Recurrent neural network:1||templated electrodeposition:1||Regime maps:1||Roll transfer process:1||Shock wave:1||Silicon 3D manifold:1||thermal degradation:1||Silicon microchannel manifold:1||thermal energy storage:1||Single droplet:1||Single jet:1||Singleand twophase cooling:1||Singlephase water cooling experiments:1||Spray cooling:1||3D integrated circuit:1||Bouncing dynamics:1||Thermal loading:1||Boiling heat transfer:1||Thermal performance:1||Thermal performance index:1||Thermosyphon:1||Thinfilm evaporation:1||Boiling heat pipe:1||thermal performance index:1||Battery thermal management:1||Twophase flow:1||Unidirectional rough surface:1||Unipolar charge injection:1||Universal model:1||Vertical downflow:1||Vertical upflow:1||Anticorrosion coating:1||Water electrification:1||Wettability transition:1||Wetting speed:1||XGBoost:1||aerodynamic characteristics:1||aerodynamic force:1||thermal resistance:1||binary mixture droplet (이종혼합물 액적):1||bismuth telluride:1||Aircooled condensers:1||boilinginduced degradation:1||branched tube:1||carbon nanotubes:1||chip cooling:1||coldplate microchannel:1||concentration measurement (농도 측정):1||trailingedge modification:1||copper inverse opal:1||corrosion:1||critical heat flux:1||Additive manufacturing:1||droplet evaporation (액적 증발):1||electrocatalysts:1||A. GaNondiamond:1||embedded microchannel:1||embedded microchannels:1||erosion:1||transient thermal management:1||evaporative cooling:1||film cooling:1||film cooling effectiveness:1||flexible electronics:1||flow boiling:1||friction factor:1||fuel consumption:1||gas turbine performance:1||twophase cooling:1||heterostructures:1||hierarchical structure:1||water:1||hydrogen combustion:1||infrared (IR) measurement:1||Condensed droplet:1||Conductivity:1||Conjugate thermalfluidic numerical simulations:1||Cooling:1||Copper:1||Computational twophase flow:1||Computational phase change:1||극저온 챔버:1||laser ablation:1||Cryogenic Chamber:1||D. Nearjunction thermal transport:1||D. Thermal boundary resistance:1||D. Thermal conductivity:1||Computational FLUENT model:1||laserinduced graphene:1||Deeplearning model:1||Diamond:1||Dynamic artificial neural network:1||EHD conduction pumping:1||EHD pumping:1||micropin fin array:1||Effectiveness:1||Electric vehicles:1||Compressible flow:1||Electronic cooling:1||Compressed hydrogen:1||Electrospray:1||microchannel:1||Embedded microchannel:1||Cohesivezone law:1||Energy harvesting:1||Energy storage:1||Energyefficient cooling:1||Ensemble learning:1||microchannel heat sinks:1||Evaporation:1||Exhaust noise:1||Explicitly defined:1||Falling film:1||Finite element analysis:1||Flexible:1||microdroplets:1||Capillaryenhanced boiling:1||Flow boiling heat transfer:1||

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