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Results 1-1 of 1 (Search time: 0.243 seconds).
A novel process to control the surface roughness and resistivity of electroplated Cu using thiourea
Kang, MS;
Kim, Soo-Kil
; Kim, JJ
Article
Issue Date
2005
Citation
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, v.44, no.11, pp 8107 - 8109
Publisher
JAPAN SOC APPLIED PHYSICS
1
Discover
Author
Kang, MS
1
Kim, JJ
1
Kim, Soo Kil
1
Subject
ACID
1
ADDITION AGENTS
1
BENZOTRIAZOLE
1
brightener
1
COPPER ELECTRODEPOSITION
1
copper sulfide
1
Cu
1
electroplating
1
KINETICS
1
nucleation
1
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