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FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor Go to Link

Waqar, Muhammad; Baeg, Sanghyeon; Bak, Geunyong; Kwon, Junhyeong; Lee, Kiseok; Jeon, Sang woon

ArticleIssue Date2020CitationMicroelectronics Reliability, v.114, pp 1 - 6PublisherElsevier Ltd

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Browsing by Jeon, Sang woonAuthor

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