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Browsing by Waqar, MuhammadAuthor

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Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel

Waqar, Muhammad; Chang, Young-Bin; Park, HyeonU; Baeg, Sanghyeon

ArticleIssue Date2025CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.15, no.2, pp 367 - 376PublisherInstitute of Electrical and Electronics Engineers Inc.

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DDR4 Ball Grid Array Package Intermittent Fracture Effect on Signal Integrity Go to Link

Waqar, Muhammad; Chang, Young-Bin; Kwon, Junhyeong; Kim, Jeong-Hwan; Baeg, Sanghyeon

ArticleIssue Date2023CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.13, no.1, pp 70 - 78PublisherInstitute of Electrical and Electronics Engineers Inc.

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Ddr4 ber degradation due to crack in fbga package solder ball Go to Link open access

Waqar, Muhammad; Bak, Geunyong; Kwon, Junghyeong; Baeg, Sanghyeon

ArticleIssue Date2021CitationElectronics (Switzerland), v.10, no.12, pp 1 - 9PublisherMDPI AG

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FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor Go to Link

Waqar, Muhammad; Baeg, Sanghyeon; Bak, Geunyong; Kwon, Junhyeong; Lee, Kiseok; Jeon, Sang woon

ArticleIssue Date2020CitationMicroelectronics Reliability, v.114, pp 1 - 6PublisherElsevier Ltd

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Browsing by Waqar, MuhammadAuthor

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