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Overlay and CD uniformity variation due to wafer thermal deformation caused by EUV exposure Go to Link

Ko, H.-C.; Choi, W.-Y.; Kim, M.-W.; Kang, J.-W.; Jeon, J.-H.; You, D.-K.; Oh, H.-K.

ArticleIssue Date2023CitationJapanese Journal of Applied Physics, v.62, no.SG, pp 1 - 10PublisherInstitute of Physics

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