Two-Step Flash-Light Sintering of Copper-Based Inkjet-Printed Patterns onto Polymer Substrates Used in Flexible Electronic Devices
- Authors
- Kang, Minkyu; Choi, SungJun; Shin, Dongho; Lee, Caroline Sunyong
- Issue Date
- Aug-2021
- Publisher
- WILEY-V C H VERLAG GMBH
- Keywords
- copper nanoparticles; flash-light sources; inkjet printing; two-step sintering
- Citation
- PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, v.218, no.16
- Indexed
- SCIE
SCOPUS
- Journal Title
- PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
- Volume
- 218
- Number
- 16
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/105751
- DOI
- 10.1002/pssa.202000775
- ISSN
- 1862-6300
- Abstract
- High-speed flash-light sintering to fabricate inkjet patterns on the flexible substrates employed in lightweight devices is used. A two-step sintering process, i.e., presintering to cause slight necking of copper nanoparticles (CNPs) and final sintering to complete densification, is used to sinter copper-based inkjet patterns. These patterns are more dense and less resistive than those formed via one-step sintering. The specific resistivity of the pattern created using only the second sintering step is 2.65 x 10(-7) omega m and that of the two-step pattern is 0.84 x 10(-7) omega m, and the value shows little change over 180 days. Two-step-sintered patterns on a polyimide substrate exhibit very dense microstructures, surface porosity <7%, and no damage. Thus, highly conductive copper-based inkjet patterns on a flexible substrate are successfully fabricated.
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