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Prediction Of Material Removal Rate And Interpretation Of Sensor Importance In Wafer Polishing Using Explainable Convolutional Neural Network

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dc.contributor.author김병훈-
dc.date.accessioned2022-07-19T03:06:47Z-
dc.date.available2022-07-19T03:06:47Z-
dc.date.issued2021-10-25-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/110233-
dc.titlePrediction Of Material Removal Rate And Interpretation Of Sensor Importance In Wafer Polishing Using Explainable Convolutional Neural Network-
dc.typeConference-
dc.citation.conferenceNameINFORMS annual meeting 2021-
dc.citation.conferencePlace온라인-
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF INDUSTRIAL & MANAGEMENT ENGINEERING > 2. Conference Papers

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ERICA 공학대학 (DEPARTMENT OF INDUSTRIAL & MANAGEMENT ENGINEERING)
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