Preparation of Adhesion Promoter for Lead Frame Adhesion and Application to Epoxy Composite
- Authors
- Kim, Jung Soo; Kim, Eun-jin; Kim, Dong Hyun
- Issue Date
- Jun-2022
- Publisher
- RUBBER SOC KOREA
- Keywords
- adhesion promoter; adhesive strength; epoxy composite; Ni lead frame; itaconic acid-co-acrylamide
- Citation
- ELASTOMERS AND COMPOSITES, v.57, no.2, pp.48 - 54
- Indexed
- KCI
- Journal Title
- ELASTOMERS AND COMPOSITES
- Volume
- 57
- Number
- 2
- Start Page
- 48
- End Page
- 54
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/111082
- DOI
- 10.7473/EC.2022.57.2.48
- ISSN
- 2092-9676
- Abstract
- A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.
- Files in This Item
-
Go to Link
- Appears in
Collections - GRADUATE SCHOOL OF INDUSTRIAL CONVERGENCE > GRADUATE SCHOOL OF INDUSTRIAL CONVERGENCE > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/111082)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.