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A Backside-Illuminated Charge-Focusing Silicon SPAD With Enhanced Near-Infrared Sensitivity

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dc.contributor.authorVan Sieleghem, Edward-
dc.contributor.authorKarve, Gauri-
dc.contributor.authorDe Munck, Koen-
dc.contributor.authorVinci, Andrea-
dc.contributor.authorCavaco, Celso-
dc.contributor.authorSuss, Andreas-
dc.contributor.authorVan Hoof, Chris a-
dc.contributor.authorLee, Jiwon-
dc.date.accessioned2023-07-05T05:31:26Z-
dc.date.available2023-07-05T05:31:26Z-
dc.date.issued2022-03-
dc.identifier.issn0018-9383-
dc.identifier.issn1557-9646-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/112875-
dc.description.abstractA backside-illuminated (BSI) near-infrared (NIR)-enhanced silicon single-photon avalanche diode (SPAD) for time-of-flight (ToF) light detection and ranging applications is presented. The detector contains a 2- boldsymbol μm -wide multiplication region with a spherically uniform electric field peak enforced by field-line crowding. A charge-focusing electric field extends into a 10- boldsymbol μm -deep absorption volume, whereby electrons generated in all the corners of the device can move efficiently toward the multiplication region. The SPAD is integrated with a customized 130-nm CMOS technology and a dedicated BSI process. The device has a pitch of 15 boldsymbol μm, which has the potential to be scaled down without significant performance loss. Furthermore, the detector achieves a photon detection efficiency (PDE) of 27% at 905 nm, with an excess bias of 3.5 V that is controlled by integrated CMOS electronics, and a timing resolution of 240 ps. By virtue of these features, the device architecture is well-suited for large-format ToF imaging arrays with integrated electronics. © 1963-2012 IEEE.-
dc.format.extent8-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.titleA Backside-Illuminated Charge-Focusing Silicon SPAD With Enhanced Near-Infrared Sensitivity-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TED.2022.3143487-
dc.identifier.scopusid2-s2.0-85124067306-
dc.identifier.wosid000751497000001-
dc.identifier.bibliographicCitationIEEE Transactions on Electron Devices, v.69, no.3, pp 1129 - 1136-
dc.citation.titleIEEE Transactions on Electron Devices-
dc.citation.volume69-
dc.citation.number3-
dc.citation.startPage1129-
dc.citation.endPage1136-
dc.type.docType정기학술지(Article(Perspective Article포함))-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusPHOTON AVALANCHE-DIODE-
dc.subject.keywordAuthorBackside illumination (BSI)-
dc.subject.keywordAuthorcharge focusing-
dc.subject.keywordAuthorCMOS integrated circuits-
dc.subject.keywordAuthorinfrared imaging-
dc.subject.keywordAuthorsingle-photon avalanche diode (SPAD)-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9696190?arnumber=9696190&SID=EBSCO:edseee-
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