Development of Wireless MEMS Inclination Sensor System for Swing Monitoring of Large-Scale Hook Structures
DC Field | Value | Language |
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dc.contributor.author | Yu, Yan | - |
dc.contributor.author | Ou, Jinping | - |
dc.contributor.author | Zhang, Jun | - |
dc.contributor.author | Zhang, Chunwei | - |
dc.contributor.author | Li, Luyu | - |
dc.date.accessioned | 2023-12-08T09:34:27Z | - |
dc.date.available | 2023-12-08T09:34:27Z | - |
dc.date.issued | 2009-04 | - |
dc.identifier.issn | 0278-0046 | - |
dc.identifier.issn | 1557-9948 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/116041 | - |
dc.description.abstract | A modular wireless microelectromechanical system (MEMS) inclination sensor system (WMISS) is developed and tested for providing structural health monitoring of large-scale hook structures. The operating principle of a 3-D-MEMS-based dual-axis inclinometer is analyzed. A wireless MEMS sensor is integrated using sensing disposal, wireless communication, and power units. The WMISS is calibrated by using a laser displacement sensor in a pendular structure. The maximal error of the wireless MEMS inclination sensor is about 1%. The resolution is +/- 0.0025 degrees. With the new-type tuned mass damper control module, an experiment on a WMISS for the swing monitoring of a Lanjiang hook model is developed. Experimental results indicate that the developed WMISS is highly precise, convenient, stable, and low cost and has long range, and thus, a WMISS can accurately and conveniently monitor the swing of a Lanjiang hook model. | - |
dc.format.extent | 7 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Institute of Electrical and Electronics Engineers | - |
dc.title | Development of Wireless MEMS Inclination Sensor System for Swing Monitoring of Large-Scale Hook Structures | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1109/TIE.2009.2012469 | - |
dc.identifier.scopusid | 2-s2.0-65549158834 | - |
dc.identifier.wosid | 000265092100021 | - |
dc.identifier.bibliographicCitation | IEEE Transactions on Industrial Electronics, v.56, no.4, pp 1072 - 1078 | - |
dc.citation.title | IEEE Transactions on Industrial Electronics | - |
dc.citation.volume | 56 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 1072 | - |
dc.citation.endPage | 1078 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Automation & Control Systems | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Automation & Control Systems | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.subject.keywordAuthor | Hook structure | - |
dc.subject.keywordAuthor | inclination | - |
dc.subject.keywordAuthor | structural health monitoring (SHM) | - |
dc.subject.keywordAuthor | wireless microelectromechanical systems (MEMS) sensor | - |
dc.subject.keywordAuthor | 3-D MEMS | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/4752773 | - |
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