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Development of Wireless MEMS Inclination Sensor System for Swing Monitoring of Large-Scale Hook Structures

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dc.contributor.authorYu, Yan-
dc.contributor.authorOu, Jinping-
dc.contributor.authorZhang, Jun-
dc.contributor.authorZhang, Chunwei-
dc.contributor.authorLi, Luyu-
dc.date.accessioned2023-12-08T09:34:27Z-
dc.date.available2023-12-08T09:34:27Z-
dc.date.issued2009-04-
dc.identifier.issn0278-0046-
dc.identifier.issn1557-9948-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/116041-
dc.description.abstractA modular wireless microelectromechanical system (MEMS) inclination sensor system (WMISS) is developed and tested for providing structural health monitoring of large-scale hook structures. The operating principle of a 3-D-MEMS-based dual-axis inclinometer is analyzed. A wireless MEMS sensor is integrated using sensing disposal, wireless communication, and power units. The WMISS is calibrated by using a laser displacement sensor in a pendular structure. The maximal error of the wireless MEMS inclination sensor is about 1%. The resolution is +/- 0.0025 degrees. With the new-type tuned mass damper control module, an experiment on a WMISS for the swing monitoring of a Lanjiang hook model is developed. Experimental results indicate that the developed WMISS is highly precise, convenient, stable, and low cost and has long range, and thus, a WMISS can accurately and conveniently monitor the swing of a Lanjiang hook model.-
dc.format.extent7-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.titleDevelopment of Wireless MEMS Inclination Sensor System for Swing Monitoring of Large-Scale Hook Structures-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TIE.2009.2012469-
dc.identifier.scopusid2-s2.0-65549158834-
dc.identifier.wosid000265092100021-
dc.identifier.bibliographicCitationIEEE Transactions on Industrial Electronics, v.56, no.4, pp 1072 - 1078-
dc.citation.titleIEEE Transactions on Industrial Electronics-
dc.citation.volume56-
dc.citation.number4-
dc.citation.startPage1072-
dc.citation.endPage1078-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaAutomation & Control Systems-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaInstruments & Instrumentation-
dc.relation.journalWebOfScienceCategoryAutomation & Control Systems-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryInstruments & Instrumentation-
dc.subject.keywordAuthorHook structure-
dc.subject.keywordAuthorinclination-
dc.subject.keywordAuthorstructural health monitoring (SHM)-
dc.subject.keywordAuthorwireless microelectromechanical systems (MEMS) sensor-
dc.subject.keywordAuthor3-D MEMS-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/4752773-
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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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