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유한요소해석법에 의한 PC Modular Panel 내진보강공법 적용 R/C 기둥의 내진성능평가

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dc.contributor.author이강석-
dc.date.accessioned2024-01-10T18:03:13Z-
dc.date.available2024-01-10T18:03:13Z-
dc.date.issued2023-10-26-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/116725-
dc.title유한요소해석법에 의한 PC Modular Panel 내진보강공법 적용 R/C 기둥의 내진성능평가-
dc.typeConference-
dc.citation.conferenceName2023년 대한건축학회 추계학술발표대회-
dc.citation.conferencePlace그랜드 하이원-
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COLLEGE OF ENGINEERING SCIENCES > MAJOR IN ARCHITECTURAL ENGINEERING > 2. Conference Papers

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LEE, KANG SEOK
ERICA 공학대학 (MAJOR IN ARCHITECTURAL ENGINEERING)
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