Heterogeneous 3-D Sequential CFETs With Ge (110) Nanosheet p-FETs on Si (100) Bulk n-FETs
DC Field | Value | Language |
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dc.contributor.author | Kim, Seong Kwang | - |
dc.contributor.author | Lim, Hyeong-Rak | - |
dc.contributor.author | Jeong, Jaejoong | - |
dc.contributor.author | Lee, Seung Woo | - |
dc.contributor.author | Jeong, Ho Jin | - |
dc.contributor.author | Park, Juhyuk | - |
dc.contributor.author | Kim, Joon Pyo | - |
dc.contributor.author | Jeong, Jaeyong | - |
dc.contributor.author | Kim, Bong Ho | - |
dc.contributor.author | Ahn, Seung-Yeop | - |
dc.contributor.author | Park, Youngkeun | - |
dc.contributor.author | Geum, Dae-Myoung | - |
dc.contributor.author | Kim, Younghyun | - |
dc.contributor.author | Baek, Yongku | - |
dc.contributor.author | Cho, Byung Jin | - |
dc.contributor.author | Kim, Sanghyeon | - |
dc.date.accessioned | 2024-01-20T09:03:19Z | - |
dc.date.available | 2024-01-20T09:03:19Z | - |
dc.date.issued | 2023-11 | - |
dc.identifier.issn | 0018-9383 | - |
dc.identifier.issn | 1557-9646 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/117854 | - |
dc.description.abstract | In this study, we report on the fabrication and characterization of 3-D sequential complementary field-effect-transistors (CFETs) using the direct wafer bonding (DWB) technology and a low-temperature process for monolithic 3-D (M3D) integration. The device features a high-performance top Ge (110)/<inline-formula> <tex-math notation=LaTeX>$\langle$</tex-math> </inline-formula>110<inline-formula> <tex-math notation=LaTeX>$\rangle$</tex-math> </inline-formula> channel on a bottom Si CMOS. To ensure high performance without causing damage to the bottom Si n-FETs, the maximum thermal budget during the fabrication of the top Ge p-FETs was limited to 400 <inline-formula> <tex-math notation=LaTeX>$^{\circ}$</tex-math> </inline-formula>C. We systematically investigated the mobility enhancement of the thin Ge (110) nanosheet (NS) channel p-FETs as a function of channel orientation. Our results demonstrate that the low effective hole mass along the <inline-formula> <tex-math notation=LaTeX>$\langle$</tex-math> </inline-formula>110<inline-formula> <tex-math notation=LaTeX>$\rangle$</tex-math> </inline-formula> direction on Ge (110) wafer provides record-high mobility of 400 cm<inline-formula> <tex-math notation=LaTeX>$^{\text{2}}$</tex-math> </inline-formula>/V<inline-formula> <tex-math notation=LaTeX>$\cdot$</tex-math> </inline-formula>s (corresponding to 760 cm<inline-formula> <tex-math notation=LaTeX>$^{\text{2}}$</tex-math> </inline-formula>/V<inline-formula> <tex-math notation=LaTeX>$\cdot$</tex-math> </inline-formula>s when normalized by footprint) at room temperature, which is the highest reported among the Ge p-FETs with similar channel thicknesses. IEEE | - |
dc.format.extent | 7 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Heterogeneous 3-D Sequential CFETs With Ge (110) Nanosheet p-FETs on Si (100) Bulk n-FETs | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1109/TED.2023.3331669 | - |
dc.identifier.scopusid | 2-s2.0-85178026732 | - |
dc.identifier.wosid | 001122452000001 | - |
dc.identifier.bibliographicCitation | IEEE Transactions on Electron Devices, v.71, no.1, pp 1 - 7 | - |
dc.citation.title | IEEE Transactions on Electron Devices | - |
dc.citation.volume | 71 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 7 | - |
dc.type.docType | Article; Early Access | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | INVERSION-LAYERS | - |
dc.subject.keywordPlus | ORIENTATION | - |
dc.subject.keywordPlus | MOBILITY | - |
dc.subject.keywordPlus | DEPENDENCE | - |
dc.subject.keywordPlus | GERMANIUM | - |
dc.subject.keywordAuthor | Complementary field-effect-transistors (CFETs) | - |
dc.subject.keywordAuthor | Epitaxial growth | - |
dc.subject.keywordAuthor | Fabrication | - |
dc.subject.keywordAuthor | Ge-OI | - |
dc.subject.keywordAuthor | Germanium | - |
dc.subject.keywordAuthor | monolithic 3-dimensional (M3D) | - |
dc.subject.keywordAuthor | MOSFETs | - |
dc.subject.keywordAuthor | Performance evaluation | - |
dc.subject.keywordAuthor | Silicon | - |
dc.subject.keywordAuthor | Substrates | - |
dc.subject.keywordAuthor | Wafer bonding | - |
dc.subject.keywordAuthor | wafer bonding | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/10325439 | - |
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