Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, Yeonho | - |
dc.contributor.author | Shin, Dongho | - |
dc.contributor.author | Kang, Minkyu | - |
dc.contributor.author | Lee, Caroline Sunyong | - |
dc.date.accessioned | 2024-04-12T00:30:21Z | - |
dc.date.available | 2024-04-12T00:30:21Z | - |
dc.date.issued | 2020-12 | - |
dc.identifier.issn | 2673-3978 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/118712 | - |
dc.description.abstract | Inkjet-printed patterns were formed on a paper substrate using anti-oxidant copper nano-ink for application to disposable electronic devices. To prevent substrate damage, the pattern was flash light sintered under ambient conditions using the multi-pulse technique. Pure copper nanoparticles were coated with 1-octanethiol for oxidation resistance using the dry-coating method. Mixing these with 1-octanol solvent at a concentration of 30 wt% produced the copper nano-ink. Photo paper was used as the substrate. The contact angle between the photo paper and copper nano-ink was 37.2° and the optimal energy density for the multi-pulse flash light sintering technique was 15.6 J/cm2. Using this energy density, the optimal conditions were an on-time of 2 ms (duty cycle of 80%) for three pulses. The resistivity of the resulting pattern was 2.8 × 10−7 Ω∙m. After bending 500 times to a radius of curvature of 30 mm, the relative resistance (ΔR/R0) of the multi-pulse flash light-sintered pattern hardly changed compared to that of the unbent pattern, while the single-pulse-sintered pattern showed dramatic increase by 8-fold compared to the unbent pattern. Therefore, the multi-pulse light sintering technique is a promising approach to produce an inkjet-printed pattern that can be applied to disposable electronic devices. © 2020 by the authors. | - |
dc.format.extent | 12 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Multidisciplinary Digital Publishing Institute (MDPI) | - |
dc.title | Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices | - |
dc.type | Article | - |
dc.publisher.location | 스위스 | - |
dc.identifier.doi | 10.3390/electronicmat1010004 | - |
dc.identifier.scopusid | 2-s2.0-85141494134 | - |
dc.identifier.bibliographicCitation | Electronic Materials, v.1, no.1, pp 28 - 39 | - |
dc.citation.title | Electronic Materials | - |
dc.citation.volume | 1 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 28 | - |
dc.citation.endPage | 39 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | Y | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | 1-octanethiol | - |
dc.subject.keywordAuthor | anti-oxidation | - |
dc.subject.keywordAuthor | copper nanoparticles | - |
dc.subject.keywordAuthor | flash light sintering | - |
dc.subject.keywordAuthor | inkjet printing | - |
dc.identifier.url | https://www.mdpi.com/2673-3978/1/1/4 | - |
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