Improvement of Productivity through the Reduction of Unexpected Equipment Faults in Die Attach Equipment
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, You-Jin | - |
dc.contributor.author | Hur, Sun | - |
dc.date.accessioned | 2021-06-22T09:05:39Z | - |
dc.date.available | 2021-06-22T09:05:39Z | - |
dc.date.issued | 2020-04 | - |
dc.identifier.issn | 2227-9717 | - |
dc.identifier.issn | 2227-9717 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/1199 | - |
dc.description.abstract | As one of the semiconductor back-end processes, die attach process is the process that attaches an individual non-defective die (or chip) produced from the semiconductor front-end production to the lead frame on a strip. With most other processes of semiconductor manufacturing, it is very important to improve productivity by lessening the occurrence of defective products generally represented as losses, and then find the fault causes which lower productivity of the die attach process. Thus, as the case study to analyze quantitatively the faults of the die attach process equipment, in this research, we developed analysis systems including statistical analysis functions to improve the productivity of die attach process. This research shows that the developed system can find the causes of equipment faults in die attach process equipment and help improve the productivity of the die attach process by controlling the critical parameters which cause unexpected equipment faults and losses. | - |
dc.format.extent | 18 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | MDPI | - |
dc.title | Improvement of Productivity through the Reduction of Unexpected Equipment Faults in Die Attach Equipment | - |
dc.type | Article | - |
dc.publisher.location | 스위스 | - |
dc.identifier.doi | 10.3390/pr8040394 | - |
dc.identifier.scopusid | 2-s2.0-85086701235 | - |
dc.identifier.wosid | 000536891900018 | - |
dc.identifier.bibliographicCitation | PROCESSES, v.8, no.4, pp 1 - 18 | - |
dc.citation.title | PROCESSES | - |
dc.citation.volume | 8 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 18 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Engineering, Chemical | - |
dc.subject.keywordAuthor | die attach process | - |
dc.subject.keywordAuthor | wafer sawing process | - |
dc.subject.keywordAuthor | back grinding process | - |
dc.subject.keywordAuthor | unexpected equipment fault | - |
dc.subject.keywordAuthor | loss | - |
dc.subject.keywordAuthor | overall equipment effectiveness (OEE) | - |
dc.subject.keywordAuthor | unit per equipment hour (UPEH) | - |
dc.subject.keywordAuthor | productivity analysis system | - |
dc.identifier.url | https://www.mdpi.com/2227-9717/8/4/394 | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.