Inverted Junction VCSEL Arrays Operating at 940 nm with ˃5 W Employing Tunnel Junction
- Authors
- Pouladi, Sara; Lee, Yong Gyeong; Kim, Nam-In; Ali, Asad; Kim, Jaekyun; Choi, Younghee; Lee, Keon Hwa; Ryou, Jae-Hyun
- Issue Date
- Dec-2024
- Publisher
- Institute of Electrical and Electronics Engineers
- Keywords
- Inverted n-p junction epitaxial structure; Large-area VCSEL arrays; n-GaAs substrate; Tunnel junction; Vertical-cavity surface-emitting lasers (VCSELs)
- Citation
- IEEE Photonics Technology Letters, v.36, no.23, pp 1 - 4
- Pages
- 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE Photonics Technology Letters
- Volume
- 36
- Number
- 23
- Start Page
- 1
- End Page
- 4
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/120829
- DOI
- 10.1109/LPT.2024.3478745
- ISSN
- 1041-1135
1941-0174
- Abstract
- We develop inverted n-p junction arrayed vertical-cavity surface-emitting lasers (VCSELs) with 875 devices operating at ∼940 nm, optimized for high optical output power in sensing applications. Employment of an n-type GaAs substrate prevents performance degradation caused by defects in p-type GaAs substrates. A tunnel junction enables polarity inversion. The inverted n-p VCSEL arrays, which are preferred for circuit design and packaging, are compared with conventional p-n junction VCSEL arrays on an n-type substrate using three-dimensional device modeling and experimental measurements. The optical output power of large-area 25×35 VCSEL arrays shows ∼5.5 W at I ≈ 6 A. The threshold current density and slopes of the L-I curve of the inverted n-p VCSEL arrays are ∼1.2 kA/cm2 and 0.98 W/A, respectively, which are similar to those of reference p-n VCSELs. The inverted n-p arrays demonstrate slightly better electrical performance, higher output power, and power conversion efficiency than p-n, enhancing their potential in voltage-controlled sensing systems. This is the first demonstration of the large-area inverted n-p VCSEL arrays, achieving the highest light output power critical for emerging 3D sensing and LiDAR applications. © 1989-2012 IEEE.
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