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PC Modular Panel 보강공법을 적용한 R/C 기둥의 내진성능평가

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dc.contributor.author이강석-
dc.date.accessioned2025-01-11T13:01:23Z-
dc.date.available2025-01-11T13:01:23Z-
dc.date.issued2024-10-24-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/121939-
dc.titlePC Modular Panel 보강공법을 적용한 R/C 기둥의 내진성능평가-
dc.typeConference-
dc.citation.conferenceName대한건축학회 추계학술대회-
dc.citation.conferencePlace더케이호텔 경주-
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COLLEGE OF ENGINEERING SCIENCES > MAJOR IN ARCHITECTURAL ENGINEERING > 2. Conference Papers

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LEE, KANG SEOK
ERICA 공학대학 (MAJOR IN ARCHITECTURAL ENGINEERING)
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