DIMM Press-fit Socket pin seating position effect on socket to system board interconnect
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 백상현 | - |
dc.date.accessioned | 2025-04-01T07:01:52Z | - |
dc.date.available | 2025-04-01T07:01:52Z | - |
dc.date.issued | 2015-09 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/122766 | - |
dc.description.abstract | This paper investigates the effect of press-fit socket pin seating position on the socket to system board interconnect. S-parameters of two channels, having different pin seating positions relative to the via holes, were measured. The s-parameters were de-embedded to find the s-parameters of socket to system board interconnection. The transmission coefficients showed better gain response between frequencies 600 MHz-1.6 GHz for slighty off-center seated socket pin channel interconnect compared to the center seated pin channel interconnect. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.title | DIMM Press-fit Socket pin seating position effect on socket to system board interconnect | - |
dc.type | Conference | - |
dc.citation.title | 2015 Korea Test Conference | - |
dc.citation.startPage | 12 | - |
dc.citation.endPage | 14 | - |
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