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DIMM Press-fit Socket pin seating position effect on socket to system board interconnect

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dc.contributor.author백상현-
dc.date.accessioned2025-04-01T07:01:52Z-
dc.date.available2025-04-01T07:01:52Z-
dc.date.issued2015-09-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/122766-
dc.description.abstractThis paper investigates the effect of press-fit socket pin seating position on the socket to system board interconnect. S-parameters of two channels, having different pin seating positions relative to the via holes, were measured. The s-parameters were de-embedded to find the s-parameters of socket to system board interconnection. The transmission coefficients showed better gain response between frequencies 600 MHz-1.6 GHz for slighty off-center seated socket pin channel interconnect compared to the center seated pin channel interconnect.-
dc.language영어-
dc.language.isoENG-
dc.titleDIMM Press-fit Socket pin seating position effect on socket to system board interconnect-
dc.typeConference-
dc.citation.title2015 Korea Test Conference-
dc.citation.startPage12-
dc.citation.endPage14-
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Baeg, Sanghyeon
ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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