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중국 첨단 반도체 혁신역량 분석연구: 고대역 메모리(HBM)와 3세대 반도체를 중심으로

Authors
백서인
Issue Date
Dec-2024
Publisher
대외경제정책연구원
Pages
113
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/125227
ISBN
9788932225166
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