Atomic resolution quality control for Fin oxide recess by atomic resolution profiler
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Tae-Gon | - |
dc.contributor.author | Ryu, Heon-Yul | - |
dc.contributor.author | Kenis, Karine | - |
dc.contributor.author | Jo, Ah-Jin | - |
dc.contributor.author | Cho, Sang-Joon | - |
dc.contributor.author | Park, Sang-Il | - |
dc.contributor.author | Schmidt, Sebastian | - |
dc.contributor.author | Irmer, Bernd | - |
dc.date.accessioned | 2021-06-22T18:09:51Z | - |
dc.date.available | 2021-06-22T18:09:51Z | - |
dc.date.created | 2021-01-22 | - |
dc.date.issued | 2016-09 | - |
dc.identifier.issn | 1012-0394 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/15652 | - |
dc.description.abstract | A non-destructive metrology technique for critical dimension of Fin structure is important for better device characterization and development for improving yield. Due to extremely small dimension with high complexity in FinFET a new metrology solution needs to be evaluated. In-line atomic resolution profiler was performed to provide a suitable metrology for oxide recess metrology in Fin process. The technique could measure accurately the height and CD of Fin structures, which has the space with of 25 nm and the height of 60 nm. The uniformity of recess height could be measured, which could be interpreted by loading effect of etch process. High long term repeatability of the technique was achieved for process monitoring purpose. © 2016 Trans Tech Publications, Switzerland. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Trans Tech Publications Ltd | - |
dc.title | Atomic resolution quality control for Fin oxide recess by atomic resolution profiler | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Tae-Gon | - |
dc.identifier.doi | 10.4028/www.scientific.net/SSP.255.304 | - |
dc.identifier.scopusid | 2-s2.0-84988442251 | - |
dc.identifier.bibliographicCitation | Solid State Phenomena, v.255, pp.304 - 308 | - |
dc.relation.isPartOf | Solid State Phenomena | - |
dc.citation.title | Solid State Phenomena | - |
dc.citation.volume | 255 | - |
dc.citation.startPage | 304 | - |
dc.citation.endPage | 308 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordPlus | Atomic force microscopy | - |
dc.subject.keywordPlus | FinFET | - |
dc.subject.keywordPlus | Fins (heat exchange) | - |
dc.subject.keywordPlus | Measurement | - |
dc.subject.keywordPlus | Process monitoring | - |
dc.subject.keywordPlus | Atomic resolution | - |
dc.subject.keywordPlus | Critical dimension | - |
dc.subject.keywordPlus | Device characterization | - |
dc.subject.keywordPlus | Fin structures | - |
dc.subject.keywordPlus | High complexity | - |
dc.subject.keywordPlus | In-line monitoring | - |
dc.subject.keywordPlus | Loading effects | - |
dc.subject.keywordPlus | Non-destructive metrologies | - |
dc.subject.keywordPlus | Quality control | - |
dc.subject.keywordAuthor | Atomic force microscopy | - |
dc.subject.keywordAuthor | Atomic resolution profiler | - |
dc.subject.keywordAuthor | FinFET | - |
dc.subject.keywordAuthor | In-line monitoring | - |
dc.subject.keywordAuthor | Metrology | - |
dc.subject.keywordAuthor | Oxide recess | - |
dc.identifier.url | https://www.proquest.com/docview/1817939032?accountid=11283 | - |
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