The impact of the residual stress on the EUV pellicle
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Eun-Sang | - |
dc.contributor.author | Choi, Jae-Keun | - |
dc.contributor.author | Kim, Min-Ha | - |
dc.contributor.author | Hwang, Sollee | - |
dc.contributor.author | Shamsi, Zahid Hussain | - |
dc.contributor.author | Kim, Dai-Gyoung | - |
dc.contributor.author | Oh, Hye-Keun | - |
dc.date.accessioned | 2021-06-22T18:21:37Z | - |
dc.date.available | 2021-06-22T18:21:37Z | - |
dc.date.created | 2021-01-22 | - |
dc.date.issued | 2016-05 | - |
dc.identifier.issn | 0277-786X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/15964 | - |
dc.description.abstract | High resolution patterning on the chip could be achieved by extreme ultraviolet lithography (EUVL). However, the defect on the mask becomes more important issue with very short wavelength (13.5 nm). Using the pellicle which could protect the mask from the defects can support high volume manufacturing (HVM). Most of the materials considered for pellicle have relatively high extinction coefficient in EUV region. Therefore, the thickness of the pellicle should be ∼ nm thin. The stress of the pellicle is dependent not only on the temperature but also on the mechanical properties of the pellicle. The stress induced by the gravity was small compared to the thermal stress. However, the residual stress should be also considered since it is dependent on the pellicle manufacturing environment and this stress is comparable with the thermal stress. Our result shows the importance of the lowering the pellicle fabrication temperature in terms of the extending the lifetime during the scanning process. © 2016 SPIE. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | SPIE | - |
dc.title | The impact of the residual stress on the EUV pellicle | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Dai-Gyoung | - |
dc.contributor.affiliatedAuthor | Oh, Hye-Keun | - |
dc.identifier.doi | 10.1117/12.2241276 | - |
dc.identifier.scopusid | 2-s2.0-84989321826 | - |
dc.identifier.bibliographicCitation | Proceedings of SPIE - The International Society for Optical Engineering, v.9984 | - |
dc.relation.isPartOf | Proceedings of SPIE - The International Society for Optical Engineering | - |
dc.citation.title | Proceedings of SPIE - The International Society for Optical Engineering | - |
dc.citation.volume | 9984 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordPlus | Defects | - |
dc.subject.keywordPlus | Extreme ultraviolet lithography | - |
dc.subject.keywordPlus | Lithography | - |
dc.subject.keywordPlus | Manufacture | - |
dc.subject.keywordPlus | Photomasks | - |
dc.subject.keywordPlus | Residual stresses | - |
dc.subject.keywordPlus | Thermal stress | - |
dc.subject.keywordPlus | High extinction coefficients | - |
dc.subject.keywordPlus | High volume manufacturing | - |
dc.subject.keywordPlus | High-resolution patterning | - |
dc.subject.keywordPlus | Manufacturing environments | - |
dc.subject.keywordPlus | mechanical | - |
dc.subject.keywordPlus | pellicle | - |
dc.subject.keywordPlus | residual | - |
dc.subject.keywordPlus | thermal | - |
dc.subject.keywordPlus | Stresses | - |
dc.subject.keywordAuthor | EUVL | - |
dc.subject.keywordAuthor | mechanical | - |
dc.subject.keywordAuthor | pellicle | - |
dc.subject.keywordAuthor | residual | - |
dc.subject.keywordAuthor | stress | - |
dc.subject.keywordAuthor | thermal | - |
dc.identifier.url | https://www.spiedigitallibrary.org/conference-proceedings-of-spie/9984/1/The-impact-of-the-residual-stress-on-the-EUV-pellicle/10.1117/12.2241276.short | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.