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An Efficient Multiple Cell Upsets Tolerant Content-Addressable Memory

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dc.contributor.authorAbbas, Syed Mohsin-
dc.contributor.authorLee, Soonyoung-
dc.contributor.authorBaeg, Sanghyeon-
dc.contributor.authorPark, Sungju-
dc.date.accessioned2021-06-22T23:02:12Z-
dc.date.available2021-06-22T23:02:12Z-
dc.date.created2021-01-21-
dc.date.issued2014-08-
dc.identifier.issn0018-9340-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/22348-
dc.description.abstractMultiple cell upsets (MCUs) become more and more problematic as the size of technology reaches or goes below 65 nm. The percentage of MCUs is reported significantly larger than that of single cell upsets (SCUs) in 20 nm technology. In SRAM and DRAM, MCUs are tackled by incorporating single-error correcting double-error detecting (SEC-DED) code and interleaved data columns. However, in content-addressable memory (CAM), column interleaving is not practically possible. A novel error correction code (ECC) scheme is proposed in this paper that will cater for ever-increasing MCUs. This work demonstrated that m parity bits are sufficient to cater for up to m-bit MCUs, with an understanding of the physical grouping of MCUs. The results showed that the proposed scheme requires 85% fewer parity bits compared to traditional Hamming distance based schemes.-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE COMPUTER SOC-
dc.titleAn Efficient Multiple Cell Upsets Tolerant Content-Addressable Memory-
dc.typeArticle-
dc.contributor.affiliatedAuthorBaeg, Sanghyeon-
dc.contributor.affiliatedAuthorPark, Sungju-
dc.identifier.doi10.1109/TC.2013.90-
dc.identifier.scopusid2-s2.0-84904806348-
dc.identifier.wosid000341523800021-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON COMPUTERS, v.63, no.8, pp.2094 - 2098-
dc.relation.isPartOfIEEE TRANSACTIONS ON COMPUTERS-
dc.citation.titleIEEE TRANSACTIONS ON COMPUTERS-
dc.citation.volume63-
dc.citation.number8-
dc.citation.startPage2094-
dc.citation.endPage2098-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaComputer Science-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryComputer Science, Hardware & Architecture-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusSRAMS-
dc.subject.keywordAuthorError correcting code-
dc.subject.keywordAuthormultiple cell upsets-
dc.subject.keywordAuthorsoft-error rate-
dc.subject.keywordAuthorsingle-error correcting codes-
dc.subject.keywordAuthorparity bits-
dc.subject.keywordAuthorMCU confinement-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/6497044/-
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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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