High Power LED 열압착 공정 특성 연구

Abstract

Recently, the use of LED is increasing. This paper presents the new packageprocess of thermal compression bonding using metal layered LED chip for thehigh power LED device. Effective thermal dissipation, which is required in thehigh power LED device, is achieved by eutectic/flip chip bonding method usingmetal bond layer on a LED chip. In this study, the process condition for the LEDeutectic die bonder system is proposed by using the analysis program, and someexperimental results are compared with those obtained using a DST (Die ShearTester) to illustrate the reliability of the proposed process condition. The cause ofbonding failures in the proposed process is also investigated experimentally.