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UV- and thermal-curing behaviors of dual-curable adhesives using divinyl sulfone

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dc.contributor.author장영욱-
dc.date.accessioned2021-06-22T09:44:37Z-
dc.date.available2021-06-22T09:44:37Z-
dc.date.issued2020-10-30-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2625-
dc.titleUV- and thermal-curing behaviors of dual-curable adhesives using divinyl sulfone-
dc.typeConference-
dc.citation.conferenceName2020 한국공업화학회 학술대회-
dc.citation.conferencePlace광주 김대중컨벤션센터-
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Chang, Young-Wook
ERICA 공학대학 (ERICA 배터리소재화학공학과)
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