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Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 안유민 | - |
| dc.date.accessioned | 2021-06-23T02:29:03Z | - |
| dc.date.available | 2021-06-23T02:29:03Z | - |
| dc.date.issued | 2007-11-08 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/26856 | - |
| dc.title | Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The Sixth Pacific Rim International Conference on Advanced Materials and Processing | - |
| dc.citation.conferencePlace | Jeju, Korea | - |
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Related Researcher
- Ahn, Yoomin
- ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)