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An Automated visual Inspection of SolderJoints Using 2D and 3D Features

Authors
문영식
Issue Date
1-Dec-1996
Publisher
IEEE
Citation
WACV
URI
https://scholarworks.bwise.kr/erica/handle/2020.sw.erica/36109
Conference Name
WACV
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COLLEGE OF COMPUTING > SCHOOL OF COMPUTER SCIENCE > 2. Conference Papers

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