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Improved Thermal Stability of modeifiedTiN/Ti barrier metals for sub-micron word line contacts
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 오재응 | - |
| dc.date.accessioned | 2021-06-23T11:09:45Z | - |
| dc.date.available | 2021-06-23T11:09:45Z | - |
| dc.date.created | 2020-12-17 | - |
| dc.date.issued | 1992-03-01 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/38461 | - |
| dc.title | Improved Thermal Stability of modeifiedTiN/Ti barrier metals for sub-micron word line contacts | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 오재응 | - |
| dc.identifier.bibliographicCitation | International Electron Devices& Materials Symposium | - |
| dc.relation.isPartOf | International Electron Devices& Materials Symposium | - |
| dc.citation.title | International Electron Devices& Materials Symposium | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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