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n-ZnO:Ga/i-ZnO/p-Si heterojunction light emitting diodes fabricated on patterned Si substrates

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dc.contributor.authorChoi, Mi Kyung-
dc.contributor.authorHan, Won Suk-
dc.contributor.authorKim, Young Yi-
dc.contributor.authorKong, Bo Hyun-
dc.contributor.authorCho, Hyung Koun-
dc.contributor.authorKim, Jae Hyun-
dc.contributor.authorSeo, Hong-Seok-
dc.contributor.authorKim, Kang-Pil-
dc.contributor.authorLee, Jung-Ho-
dc.date.accessioned2021-06-23T14:40:14Z-
dc.date.available2021-06-23T14:40:14Z-
dc.date.created2021-01-21-
dc.date.issued2009-12-
dc.identifier.issn0957-4522-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/40632-
dc.description.abstractn-ZnO:Ga/i-ZnO/p-Si heterojunction light-emitting diodes were fabricated on patterned Si substrates with increased interface area where hole carriers were transported to the i-ZnO layer. The patterned Si substrates were prepared by electrochemical etching, and the n-type ZnO:Ga films were deposited by high-temperature sputtering. In the patterned LED, the lower breakdown and greater leakage current under a reverse bias was attributed to the formation of a high density of grain boundaries and random tilting of the c-axis. Compared to an LED without patterning, the patterned substrates resulted in approximately 75% improvement in the output power of visible emission, which was attributed to a 1.33-fold increase in the heterojunction area and the increase in grain boundary density due to grain tilting.-
dc.language영어-
dc.language.isoen-
dc.publisherKluwer Academic Publishers-
dc.titlen-ZnO:Ga/i-ZnO/p-Si heterojunction light emitting diodes fabricated on patterned Si substrates-
dc.typeArticle-
dc.contributor.affiliatedAuthorLee, Jung-Ho-
dc.identifier.doi10.1007/s10854-009-9854-y-
dc.identifier.scopusid2-s2.0-70350345446-
dc.identifier.wosid000270780500011-
dc.identifier.bibliographicCitationJournal of Materials Science: Materials in Electronics, v.20, no.12, pp.1214 - 1218-
dc.relation.isPartOfJournal of Materials Science: Materials in Electronics-
dc.citation.titleJournal of Materials Science: Materials in Electronics-
dc.citation.volume20-
dc.citation.number12-
dc.citation.startPage1214-
dc.citation.endPage1218-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusTEMPERATURE-
dc.subject.keywordPlusEPITAXY-
dc.subject.keywordAuthorEPITAXY-
dc.subject.keywordAuthorTEMPERATURE-
dc.identifier.urlhttps://link.springer.com/article/10.1007%2Fs10854-009-9854-y-
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ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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