Removal of Organic Wax and Particles on Final Polished Wafer by Ozonated DI Water
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jae-Hwan Yi | - |
dc.contributor.author | Seung-Ho Lee | - |
dc.contributor.author | Tae-Gon Kim | - |
dc.contributor.author | Gun-Ho Lee | - |
dc.contributor.author | Eun-Suck Choi | - |
dc.contributor.author | Jin-Goo Park | - |
dc.date.accessioned | 2021-06-23T18:37:24Z | - |
dc.date.available | 2021-06-23T18:37:24Z | - |
dc.date.created | 2021-02-01 | - |
dc.date.issued | 2008-06 | - |
dc.identifier.issn | 1225-0562 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/42916 | - |
dc.description.abstract | In this study, new cleaning process which has low cost of ownership (CoO) has been developed with ozonated DI water (DIO₃). Ozone concentration of 40 ppm at room temperature is used to remove the organic wax film and particles. Thicker than 200 Å of wax residues were still remained after commercial dewaxer treatment only. DIO₃treatment instead of a dewaxer showed the low removal rate on thick wax layer of 8000 Å due to diffusion limited reaction of ozone. A dewaxer was combined with DIO₃rinse to reduce wax removal time and remove wax residues completely. Replacing DI rinse with DIO3 rinse resulted in the surface with contact angle lower than 5˚ which indicates no further cleaning steps required. Particle removal efficiency (PRE) also improved further by combining SC-1 cleaning step with DIO₃rinsing process. The reduction of process time was obtained by introducing DIO₃cleaning with dewaxing process. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | 한국재료학회 | - |
dc.title | Removal of Organic Wax and Particles on Final Polished Wafer by Ozonated DI Water | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Tae-Gon Kim | - |
dc.contributor.affiliatedAuthor | Jin-Goo Park | - |
dc.identifier.doi | 10.3740/MRSK.2008.18.6.307 | - |
dc.identifier.scopusid | 2-s2.0-47649125406 | - |
dc.identifier.bibliographicCitation | Korean Journal of Materials Research, v.18, no.6, pp.307 - 312 | - |
dc.relation.isPartOf | Korean Journal of Materials Research | - |
dc.citation.title | Korean Journal of Materials Research | - |
dc.citation.volume | 18 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 307 | - |
dc.citation.endPage | 312 | - |
dc.type.rims | ART | - |
dc.identifier.kciid | ART001261530 | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordPlus | Cleaning | - |
dc.subject.keywordPlus | Cobalt compounds | - |
dc.subject.keywordPlus | Dewaxing | - |
dc.subject.keywordAuthor | DIO₃(ozonated DI water) | - |
dc.subject.keywordAuthor | organic wax | - |
dc.subject.keywordAuthor | dewaxer | - |
dc.subject.keywordAuthor | final polished wafer | - |
dc.subject.keywordAuthor | particle removal efficiency (PRE) | - |
dc.subject.keywordAuthor | wax removal. | - |
dc.identifier.url | http://db.koreascholar.com/Article?code=296855 | - |
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