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300mm 웨이퍼 위의 에어로졸 나노 입자의 증착장비 개발을 위한 수치 해석적 연구Numerical Simulation of Deposition Chamber for Aerosol Nanoparticles Upward 300 mm Wafer

Other Titles
Numerical Simulation of Deposition Chamber for Aerosol Nanoparticles Upward 300 mm Wafer
Authors
안강호안진홍이관수임광옥강윤호
Issue Date
Mar-2005
Publisher
반도체및디스플레이장비학회
Keywords
Deposition Chamber; Diffusion; Electrophoresis; Nanoparticles; Numerical Simulation; Thermophoresis; Wafer
Citation
반도체및디스플레이장비학회지, v.4, no.1, pp 49 - 53
Pages
5
Indexed
DOMESTIC
Journal Title
반도체및디스플레이장비학회지
Volume
4
Number
1
Start Page
49
End Page
53
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46054
ISSN
1598-6543
Abstract
The nanoparticle deposition chamber, which is used for quantum dot semiconductor memory applications, is designed by means of numerical simulation. In this research, the numerical simulations for deposition chamber were performed by commercial software, FLUENT. The deposition of nanoparticles is calculated by diffusion force, thermophoresis and electrophoresis of particles. As a results, when the diffusion force was considered, the most of particles deposited in the wall of deposition chamber. But as considering thermophoresis and electrophoresis of particles, the particles were deposited wafer surface, perfectly.
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MECHANICAL ENGINEERING > 1. Journal Articles

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