Contact hole reflow by finite element method
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Sang-Kon | - |
dc.contributor.author | An,Ilsin | - |
dc.contributor.author | Oh,Hye-Keun. | - |
dc.contributor.author | Lee, Sun Muk | - |
dc.contributor.author | Bok, Cheolkyu | - |
dc.contributor.author | Moon,Seung Chan . | - |
dc.date.accessioned | 2021-06-24T00:09:05Z | - |
dc.date.available | 2021-06-24T00:09:05Z | - |
dc.date.issued | 2005-05 | - |
dc.identifier.issn | 1605-7422 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46487 | - |
dc.description.abstract | Thermal reflow process is one of many used processes for pattern shrinkage and resolution enhancement technology. In this study, we try to describe the shrinkage phenomena of linear static in contact hole patterns by using the finite element method. The resist of thermal flow replaces into a circular saw blade for the linear conduction thermal analysis. By using a commercial tool such as I-DEAS, the characteristic parameters of shrinkage and deformations due to thermal reflow are analyzed and compared with the experimental results. Hence, for the linear static phenomena, those mechanical simulations can be shown a good prediction of different contact hole patterns with various pattern sizes and duty ratios. In the last part, we describe the effect of surface tension. In thermal reflow process, the side-wall angle of resist profile is decreased by surface tension. Its phenomena are shown as similar in the spin coating process by modeling a dimensionless parameter in spin coating. | - |
dc.format.extent | 8 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.title | Contact hole reflow by finite element method | - |
dc.type | Article | - |
dc.identifier.doi | 10.1117/12.600704 | - |
dc.identifier.scopusid | 2-s2.0-24644482605 | - |
dc.identifier.wosid | 000229580700127 | - |
dc.identifier.bibliographicCitation | Progress in Biomedical Optics and Imaging - Proceedings of SPIE, v.5753, no.II, pp 1194 - 1201 | - |
dc.citation.title | Progress in Biomedical Optics and Imaging - Proceedings of SPIE | - |
dc.citation.volume | 5753 | - |
dc.citation.number | II | - |
dc.citation.startPage | 1194 | - |
dc.citation.endPage | 1201 | - |
dc.type.docType | Conference Paper | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Characterization & Testing | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.subject.keywordPlus | Coating techniques | - |
dc.subject.keywordPlus | Computer simulation | - |
dc.subject.keywordPlus | Finite element method | - |
dc.subject.keywordPlus | Pattern recognition | - |
dc.subject.keywordPlus | Shrinkage | - |
dc.subject.keywordPlus | Thermal effects | - |
dc.subject.keywordPlus | Contact hole | - |
dc.subject.keywordPlus | Lithography simulation | - |
dc.subject.keywordPlus | Thermal flow | - |
dc.subject.keywordPlus | Thermal reflow process | - |
dc.subject.keywordPlus | Contact angle | - |
dc.subject.keywordAuthor | Finite element method | - |
dc.subject.keywordAuthor | Lithography simulation | - |
dc.subject.keywordAuthor | Thermal flow | - |
dc.subject.keywordAuthor | Thermal reflow process | - |
dc.identifier.url | https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5753/1/Contact-hole-reflow-by-finite-element-method/10.1117/12.600704.short | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.